Reliability Technology: Principles and Practice of Failure Prevention in Electronic Systems

Reliability Technology: Principles and Practice of Failure Prevention in Electronic Systems

Volumn , Issue , 2011, Pages

  Pascoe, Norman ^a  

^a Northern Telecomm Europe Ltd   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84891583851     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1002/9780470980101     Document Type: Book

References (150)

1. Frederik Nebeker, "Digital Signal Processing and the Rise of Consumer Electronics", IEE History of Technology Professional Network Launch. University of Birmingham 5 July 2002
2. Brendan Davis, "The Economics of Automatic Testing", McGraw-Hill Book Company (UK) Ltd. 1982
3. Patrick D. T. O'Connor, "Practical Reliability Engineering", John Wiley & Sons Ltd 2002
4. Sir Ronald Fisher, "The Design of Experiments", Oliver and Boyd, London 1935
5. G. Taguchi, "System of Experimental Design", UNIPUB/Krans International Publications, vols. 1 and 2, 1987
6. Taiichi Ohno, "Toyota Production System, Beyond Large-Scale Production", Productivity Press, New York, 1988
7. Shigeo Shingo, "Kaizen and The Art of Creative Thinking", PCS Inc and Enna Products Corporation 1958
8. Steve Wilks, Electronics Weekly, 22 April 2008
9. Frank Nixon C.B.E., "Managing to Achieve Quality and Reliability", McGrawHill Publishing Company Limited 1971
10. S. Hilliard,"An AQL Primer for Purchasing Agents", H & H Servico Corp. Population Reference Bureau, "Population, A Lively Introduction", Population Bulletin, Vol. 53, No. 3, September 1998
11. Population Reference Bureau, "Population, A Lively Introduction", Population Bulletin, Vol. 53, No. 3, September 1998
12. Harold Goldberg, "Extending the Limits of Reliability Theory", John Wiley & Sons, 1981
13. Pradeep Lall, Michael G. Pecht, Edward B. Hakim, "Influence of Temperature on Microelectronics", CRC Press LLC, 1997
14. T.A. Krinke and D.K. Pai,"COTS/ROTS for Mission-Critical Systems", General Dynamics Information Systems
15. "Upgrading COTS Workshops", CALCE, EPRC, University of Maryland, January 23 1997
16. "International Workshop on Electronic Components for the Commercialisation of Military and Space Systems", San Diego, CA, February 2-5, 1997
17. "International Workshop on Electronic Components for the Commercialisation of Military and Space Systems", San Diego, CA, February 7-10, 1999
18. John Fink,"Plastic ICs-An Approach To Using Them That Has Demonstrated Better Field Reliability Than With Ceramic Military Parts", Proceedings of the Electronic Components for the Commercialisation of Military and Space Systems, San Diego, CA February 2-5, 1997
19. Sir RobertWalmsley, KCB FEng, Chief of Defence Procurement, "SMART Procurement", http://www.mod.uk/policy/spi/cdparticle.htm
20. "The Acquisition Handbook. A guide to SMART Procurement", SPI/05MODEL/Acquisition Route Map/Rout Map Draft 0.4b-23 October 1998
21. SMART PROCUREMENT "The New Acquisition Cycle-Key Features" http://www.mod.uk/policy/spi/iptguide/newcycle.htm
22. SMART PROCUREMENT "A Quick Guide To The Smart Procurement Initiative" http://www.mod.uk/policy/spi/iptguide/quickgde.htm
23. "An introduction to a better way of acquiring equipment for the UK's Armed Forces", Edition 2-August 1999, MoD Abbey Wood 31837
24. Finn Jensen, "Electronic Component Reliability", John Wiley & Sons, 1995
25. E. AjithAmerasekera, FaridN. Najm, "FailureMechanisms in SemiconductorDevices", JohnWiley&Sons, 1997
26. Michael Pecht, "Why The Traditional Reliability Prediction Models Do Not Work-Is There an Alternative", CALCE Electronic Packaging Research Centre, University of Maryland, College Park, MD20742, December 11, 1998
27. Michael W. Deckert,"Physics of Failure, A Science Based Approach to Ultra High Reliability", Program Manager, September-October 1994
28. Copyright © 2003 Method123® 1840 W. Whittier Blvd # 1596, CA 90631, USA.
29. Mark C. Paulk, Charles V. Weber, Bill Curtis, Mary Beth Crissis, "Capability Maturity ModelSM for Software, Version 1.1", Carnegie Mellon University-Software Engineering Institute, CMU/SEI-93-TR-024 ESC-TR-93-177.
30. Mark C. Paulk, Charles V. Weber, Bill Curtis, Mary Beth Crissis, (1995).
31. "The Capability Maturity Model: Guidelines for Improving the Software Process". Addison Wesley, Boston.
32. Michael Pecht, "Why Traditional Reliability Prediction Models Do Not Work-Is There an Alternative", Paper written 11 December, 1998.
33. Patrick D. T. O'Connor, "Practical Reliability Engineering", Fourth Edition, John Wiley and Sons, 2008.
34. E. Ajith Amerasekera and Farid N. Najm, "Failure Mechanisms in Semiconductor Devices", Second Edition, John Wiley and Sons, 1997.
35. Finn Jensen, "Electronic Component Reliability, Fundamentals, Modelling, Evaluation, and Assurance", John Wiley and Sons, 1995.
36. M. Pecht, P. Lall, E. Hakim, "The Influence of Temperature on Integrated Circuit Failure Mechanisms", Quality and Reliability International, 167(1992)
37. Pradeep Lall, Michael G. Pecht, Edward B. Hakim, "Influence of Temperature on Microelectronics and System Reliability", CRC Press LLC, 1997.
38. Michael G. Pecht, Riki Radojcic, Gopal Rao, "Guidebook for Managing Silicon Chip Reliability", CRC Press LLC, 1998.
39. C. Duvvury, S. Aur, "Hot Carrier Degradation Effects for DRAM Circuits", in Hot Carrier Design Considerations For MOS Devices and Circuits, C. T. Weng, ed., Van Nostrand Reinhold, 1992.
40. Mahulikar, D., Pasqualoni, A., Crane, J., Braden, J., "Development of a Cost Effective High Performance Metal QFP Packaging System", IEEE Transactions o Components, Hybrida and manufacturing Technology, Vol. 16, Issue 8, Dec. 1993, pp. 902-908.
41. Paul Hoffman, Mark Kriss, "Analysis and Resolution of Vibration Induced Wire Breaks in MQUAD® Cavity Packages", Electronic Components and Technology Conference, 43rd Vol., Issue, 1-4 Jun 1993 pp. 405-411.
42. Perry L. Martin, "Electronic Failure Analysis Handbook", McGraw-Hill, 1999.
43. Bo Eriksson and Richard Trankell, Ericsson AB, "Lead-free Soldering of Telecommunication Network Infrastructure Products".
44. Jennie S. Hwang, "Implementing Lead-Free Electronics", McGraw-Hill Companies, Inc.
45. "Fact and Fiction in Lead Free Soldering", DKL Metals Ltd, W. Lothian.
46. Keith Gurnett and Tom Adams, "Achieving Reliability with Lead-free Solders", Military and Aerospace Electronics, Part 1 January, 2008, and Part 2 March 2008.
47. M.A. Huque, S. K. Islam, B. J. Blalock, C. Su, R.Vijayaraghavan, and L. M. Tolbert, "Silicon-on-Insulator Based High-Temperature Electronics for Automotive Applications", Department of Electrical Engineering and Computer Science, The University of Tennessee, Knoxville, and Oak Ridge National Laboratory, Oak Ridge, Tennessee, USA.
48. Paul Green, "Thermal Management Challenges in Aero Engine Controls", Thermal Management Seminar, Oxford Begbroke Science Electronics KTN. 5 March 2009.
49. Marcelo Schupbach and Alexander Lostetter, "SiC technology will meet the military's future needs", Defence Electronics, February 2007.
50. Phil Neudeck, Brent C. Gardner, "Silicon Carbide Electronics", National Aeronautics and Space Administration, Glenn Research Center, December 12, 2008.
51. Patricia Daddona, Day staff writer, "Reactor Shutdown: Dominion Learns Big Lesson From A Tiny 'Tin Whisker'", The Day Publishing Co., 2005.
52. "What's Inside Your PC?", CALCE and the University of Maryland, 2008.
53. "Lead-free Electronics", Ganesan S. and M. Pecht, John Wiley and Sons, 2006.
54. Pecht, M.And R. Kang, "Diagnostics, Prognostics and System's Health Management", (in Chinese) City University of Hong Kong, 2010.
55. Ardebili, H., and M. Pecht, "Encapsulation Technologies for Electronic Applications, Materials and Processes" for Electronic Applications Series, Elsevier Press, New York, NY, 2009.
56. Pecht, M., "Product Reliability, Maintainability, and Supportability Handbook", 2nd edn, CRC Press, Boca Raton, FL, 2009; 1st edn, 1995.
57. Pecht, M., "Prognostics and Health Management of Electronics", John Wiley Publishing Co., New York, NY, 2008.
58. Ganesan S. And M. Pecht, "Lead-Free Electronics", John Wiley Publishing Co., New York, NY, 2006.
59. John H. Lienhard IV and John H. Lienhard V, "A Heat Transfer Textbook", Third Edition, Phlogiston Press, Cambridge, MA, 2006.
60. Frank P. Incropera, David P. DeWitt, "Fundamentals of Heat and Mass Transfer", Third Edition, JohnWiley and Sons, 1990.
61. Yunus A. Çengel, "Heat Transfer: A Practical Approach", McGraw-Hill, 1998.
62. Dave S. Steinberg, "Cooling Techniques for Electronic Equipment", John Wiley and Sons, 1991.
63. Thomas D. Mc. Gee, "Principles and Methods of Temperature Measurement", John Wiley and Sons, 1988.
64. "Development and trends in thermal management technologies: a mission to the USA", Report of a DTI Global Watch Mission, 20 February 2007, London UK.
65. Henry C. Pusey,"An Historic View of Shock and Vibration", Sound and Vibration, 30 September, 2008.
66. J. W. Cooley and J. W. Tukey, "An Algorithm for the Machine Calculation of Complex Fourier Series", Mathematics Computation, Vol. 19, 1965, pp. 297-301.
67. D.E. Newland, "Random Vibrations and Spectral Analysis", Longman Scientific & Technical, 1984.
68. Dave S. Steinberg, "Vibration Analysis for Electronic Equipment", John Wiley & Sons, 1988.
69. Cyril M. Harris and Allan G. Piersol, "Shock and Vibration Handbook", McGraw-Hill, Fifth Edition, 2002.
70. Stephen H. Crandall, "Random Vibration", Technology Press, John Wiley & Sons, 1958.
71. George Henderson,"Use of SRS for Protective Package Drop Test Data Analysis", IBM Packaging Managers Seminar, Research Triangle Park, NC, January 30, 1991.
72. Peter A. Masterson,"The Basics of Vibration Isolation Using Elastomeric Materials", Technical White Paper, Aero Technologies, www.earshockandvib.com.
73. "Fixtures for B & K Exciters", Application Note, Bruel & Kjær 1987.
74. G.B. Warburton, "The Vibrations of Rectangular Plates", Proc. Inst. Mech. Eng., 168, 1954.
75. J.W.S. Rayleigh, "The Theory of Sound", Dover Publications, 1945.
76. A.W. Leissa, "Vibration of Plates", NASA Publication SP-160.
77. John Dunn,"Air strategy that can't fail", Special Report: Defence & Aerospace, August 1997.
78. MIL-STD-810G, "Environmental Engineering Considerations and Laboratory Tests", 31 October 2008.
79. MIL-HDBK-781A, "Handbook for Reliability Test Methods, Plans, and Environments for Engineering, Development, Qualification and Production", 1 April 1996.
80. MIL-STD-202G, "Test Methods for Electronic and Electrical Component Parts", 8 February 2002.
81. MIL-STD-883G, "Test Method Standard Microcircuits", 28 February 2006.
82. DEF STAN 00-35 Part 3, Issue 4, 18 September 2006.
83. Patrick D.T. O'Connor "Practical Reliability Engineering", 4th edn, John Wiley & Sons.
84. NAVMAT P-9492, "Navy Manufacturing Screening Program", 1997.
85. Frank FanWang, "Relating Sinusoid to Random Vibration for Electronic Equipment Testing", April 2003COTS Journal.
86. Hallberg, Ö. and Peck, D.S. "Recent humidity accelerations, a base for testing standards", Quality and Reliability International, vol. 7, (1991).
87. Pradeep Lall, Michael G. Pecht and Edward B. Hakim, Influence of Temperature on Microelectronics", CRC Press LLC, 1997.
88. ISO 9001 2008 Quality Management Requirements, 15 November 2008
89. NASA Reference Publication 1374 July 1995.
90. Struzak, Professor Ryszard, Europa Times No. 22, March 1995.
91. Mick Grant,"Signal Integrity Considerations for High Speed Digital Hardware Design", White Paper, Issue: 01, 11th. November 2002, CALYPTECH.
92. Taguchi G., "Introduction to Quality Engineering", Asian Productivity Organisation, 1986. (Distributed by American Supplier Institute, Inc., Dearborn, MI.)
93. Taguchi G., "System of Experimental Design", UNIPUB/Kraus International Publications, Vol. 1 and 2, 1987. (Distributed by American Supplier Institute, Inc., Dearborn, MI.)
94. Sadie Gray, "Military Clangers: Equipment Disasters of the MOD", guardian.co.uk, Wednesday 4 June 2008.
95. Patrick D.T. O'Connor, "Practical Reliability Engineering", 4th edn, John Wiley & Sons Ltd.
96. Kazuo Ozeki, Tetsuichi Asaka, "Handbook of Quality Tools-The Japanese Approach", Productivity Press Inc., Cambridge, MA.
97. Madhav S. Phadke, "Quality Engineering Using Robust Design", Prentice Hall 1989
98. Reliability For A Mature Product From The Beginning Of Useful Life". "The different type of tests and their impact on Product Reliability". CEEES Technical Advisory Board, Publication No. 9-2009, ISSN 1104-6341.
99. Squadron Leader P. Mitchell, "What the customer wants-Maintenance-Free and Failure-Free Operating Periods to improve overall system availability and reliability", Paper presented at the RTO AVT Specialists' meeting on "Design for Low Cost Operation and Support", held in Ottawa, Canada, 21-22 October 1999 and published in RTO MP-37.
100. Steve Rakitin,"Design for Testability", Food for Thought e-newsletter, March 2006,Vol.3 No.3, Software Quality Consulting, Inc.
101. Andreas Steininger, "New Approaches to Fault-Tolerant System Design", Vienna University of Technology.
102. Brendan Davis, "The Economics of Automatic Testing", McGraw-Hill Book Company (UK) Ltd., 1982.
103. David M. Anderson, "Design for Manufacturability & Concurrent Engineering; How to Design for Low Cost, Design in High Quality, Design for Lean Manufacture, and Design Quickly for Fast Production", CIM Press 805-924-0200.
104. Baralla, J.G., "Handbook of Product Design for Manufacturing", McGraw-Hill, 1988.
105. Stoll, H.W.,"Design for Manufacture", Manufacturing Engineering, January 1988.
106. MIL-STD-810G 31 October 2008, "Environmental Engineering Considerations and Laboratory Tests".
107. Miner M.A. "Cumulative Damage in Fatigue" J. Appl. Mech., 12 Sept. 1945.
108. Stephen H. Crandall, "Random Vibration", Technology Press, John Wiley & Sons, 1958.
109. Dave S. Steinberg, "Vibration Analysis for Electronic Equipment", John Wiley & Sons, 1988.
110. Dave S. Steinberg, "Cooling Techniques for Electronic Equipment", John Wiley & Sons, 1991.
111. R. E. Newton, "Fragility Assessment Theory and Test Procedure", Monterey Research Laboratories, Inc., USA, (1968).
112. Stephen R. Pierce, "A Fragility Assessment Theory and Test Procedure Demonstrated on Real Test Items", School of Packaging, Michigan State University, USA, (1970).
113. "Standard Test Methods for Mechanical-Shock Fragility of Products, Using Shock Machines",ASTMD3332-99 (2004).
114. Wayne Nelson, "Accelerated Testing Statistical Models, Test Plans, and Data Analyses", John Wiley & Sons, 1990.
115. Michael Pecht, Director CALCE, Electronics Packaging Research Centre, University of Maryland, College Park, Maryland 20742.
116. Perry L. Martin, "Electronic Failure Analysis Handbook", McGraw-Hill.
117. Root, D., "Six Step Method For Cushioned Package Development", Lansmont, 1997
118. "Standard Test Method for Random Vibration Testing of Shipping Containers", ASTM D4728-06 1 October 2006.
119. Soroka, W., "Fundamentals of Packaging Technology", Institute of Packaging Professionals, Naperville, IL, 1999.
120. Kazuo Ozeki, Tetsuichi Asaka, "Handbook of Quality Tools: The Japanese Approach", Productivity Press Inc., Cambridge, MA.
121. Patrick D. T. O'Connor, "Practical Reliability Engineering", John Wiley & Sons Ltd., 2002.
122. JESD22-A114 "Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM)".
123. MIL-STD-883G 28 Feb. 2006 "Test Method Standard Microcircuits". Method 3015.7 "Electrostatic Discharge Sensitivity Classification".
124. ANSI/ESD STM5.1-2007 "ESD Association Standard Test Method for Electrostatic Discharge Sensitivity Testing-Human Body Model (HBM) Component Level".
125. JESD22-A115 "Electrostatic Discharge (ESD) Sensitivity Testing Machine Model (MM)".
126. ANSI/ESD STM5.2-2007 "ESD Association Standard Test Method for Electrostatic Discharge Sensitivity Testing-Machine Model (MM) Component Level".
127. JESD22C-101D "Field-Induced Charge Device Model Test Method for Electrostatic Discharge Withstands Thresholds of Microelectronic Components", JEDEC Solid State Association, 2008.
128. ESD STM5.3.1 "Electrostatic Discharge (ESD) Sensitivity Testing-Charged Device Model (CDM)-Component Level", ESD Association, 1999.
129. Glen Cunningham, "Polymer Material Selection for ESD Sensitive IC Processing", Intel Test Tooling Organisation, Burn-in and Test Socket Workshop March 7-10 2004.
130. Roger J. Peirce, "The Most Common Causes of ESD Damage", Evaluation Engineering 2002.
131. Harry Shaw, Nitin Parekh, Carroll Clatterbuck, Felix Frades, "Evaluation of ESD Effects During Removal of Conformal Coatings Using Micro Abrasive Blasting".
132. "Fact and Fiction in Lead Free Soldering", DKL Metals Ltd.
133. Bo Eriksson, Richard Trankell,"Lead-free soldering of telecommunication network infrastructure products". IEEE International Symposium on Sustainable Systems and Technology, Tempe, AZ, USA, May18-20, 2009.
134. Henry Caruso, "Environmental Standards vs Real Needs: What Matters and What Does Not?", Presented at the IES Northwest Chapter Vibration Technical Seminar, 28 February 1985.
135. Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, Maryland 20742.
136. NAVMAT P-9492, "Navy Manufacturing Screening Programme", 1997.
137. Willoughby W.J., "A Corporate View of Product Acceptance Screen", Journal of the IES, pp 13-15. Jan./Feb. 1982.
138. Caruso, H.J., "An Updated Overview of Environmental Stress Screening Standards and Documents for Electronic Hardware", Journal of the IES, pp 49-63. March/April 1992.
139. The Economist 4 January 1992.
140. Caruso, H.J., "The ESS Muddle, Physics vs. Relics", Journal of the IES, pp 21-26. March/April 1995.
141. R.E. Schafer, S.P. Gray, L.E. James, E.A. McMullen,"Electronic Equipment Screening and Debugging Techniques", RADC-TR-78-55, Final Technical Report, March 1978.
142. A.E. Saari, R.E. Schafer and S.J. Van Den Berg, "Stress Screening of Electronic Hardware", RADC-TR-82-87, Hughes Aircraft Company, May 1982.
143. A.E. Saari, S.J. Van Den Berg, and J.E. Angus, "Stress Screening of Electronic Hardware", RADC-TR-86-149, Hughes Aircraft Company, September 1986.
144. MIL-STD-883G, Method 1015, "Burn-In Test Method Standard Microcircuits".
145. Pradeep Lall, Michael G. Pecht, Edward B. Hakim, "Influence of Temperature on Microelectronics", CRC Press LLC, 1997.
146. Anderson, J.R.,"Environmental Burn-In Effectiveness", McDonnell Aircraft Company, Report No.AFWALTR-80-3086.
147. Kube F. And Hirschberger G.,"An Investigation to Determine Effective Equipment Environmental Acceptance Test Methods", Report No. ADR 14-04-732, April 1973, Grumman Aerospace Corporation.
148. Dave S. Steinberg, "Vibration Analysis For Electronic Equipment", John Wiley and Sons, 1988.
149. Dave Steinberg, "Cooling Techniques for Electronic Equipment", John Wiley & Sons, 1991.
150. Miner, M.A., "Cumulative Damage in Fatigue", J. Appl. Mech., September 1945.