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Volumn 51, Issue 3-4, 2014, Pages 647-659

A thermodynamics-based cohesive model for interface debonding and friction

Author keywords

Constitutive model; Coupling; Delamination; Friction; Interface; Thermodynamics

Indexed keywords

COMMERCIAL PACKAGES; COMPRESSIVE LOADS; DISSIPATIVE PROCESS; FRICTIONAL DISSIPATION; INTERFACE DEBONDING; INTERFACE ELEMENTS; INTERFACE STRENGTH; MATERIAL MODELING;

EID: 84891030117     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijsolstr.2013.10.032     Document Type: Article
Times cited : (50)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.