Low-temperature densification and excellent thermal properties of W-Cu thermal-management composites prepared from copper-coated tungsten powders

Journal of Alloys and Compounds

Volumn 588, Issue , 2014, Pages 49-52

  Zhang, Lianmeng ^a   Chen, Wenshu ^a   Luo, Guoqiang ^a   Chen, Pingan ^a   Shen, Qiang ^a   Wang, Chuanbin ^a  

^a WUHAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

High thermal conductivity; Low coefficient of thermal expansion; Low temperature densification; Microstructure; W Cu composites

Indexed keywords

BINARY ALLOYS; COPPER ALLOYS; DENSIFICATION; EXPANSION; FIBER OPTIC SENSORS; METAL COATINGS; MICROSTRUCTURE; POWDERS; SINTERING; TEMPERATURE; TEMPERATURE CONTROL; THERMAL EXPANSION; TUNGSTEN ALLOYS;

HIGH PURITY COPPER; HIGH THERMAL CONDUCTIVITY; HOT-PRESS SINTERING; LOW COEFFICIENT OF THERMAL EXPANSIONS; LOW TEMPERATURE DENSIFICATION; NETWORK STRUCTURES; THERMAL MANAGEMENT MATERIAL; W-CU COMPOSITES;

THERMAL CONDUCTIVITY;

EID: 84888627173     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2013.11.003     Document Type: Article

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