Simulating the thermal response of thin films during photonic curing

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 7, Issue PARTS A, B, C, D, 2012, Pages 19-27

  Guillot, Martin J ^a   McCool, Steve C ^b   Schroder, Kurt A ^b  

^a UNIVERSITY OF NEW ORLEANS   (United States)

^b Novacentrix Inc ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE VOLUME METHOD; GRAPHICAL USER INTERFACES; HEAT TRANSFER; INTERFACES (MATERIALS); MICROCHANNELS; SUBSTRATES; TEMPERATURE; THIN FILMS;

CANDIDATE MATERIALS; HIGH INTENSITY; LOWS-TEMPERATURES; METAL INKS; PULSE CONDITION; PULSE PARAMETER; PULSED XENON FLASHLAMP; THERMAL RESPONSE; THIN FILM METAL; THIN-FILMS;

CURING;

EID: 84887283125     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2012-87674     Document Type: Conference Paper

References (13)

1. Zardetto, V, et al. "Substrates for flexible electronics: A practical investigation on the electrical, film flexibility, optical, temperature, and solvent resistance properties", Journal of Polymer Science Part B: Polymer Physics, 49, 638-648, 2011.
2. Wakuda, D., Hatamur, M., Suganuma, K, "Novel method for room temperature sintering of Ag nanoparticle paste in air", Chemical Physical Letters, 441, 305-308, 2007.
3. Perelaer, J., Schubert, U.S., "Inkjet Printing and Alternative Sintering of Narrow Conductive Tracks on Flexible Substrates for Plastic Electronic Applications, in Radio Frequency Identification Fundamentals and Applications, Design Methods and Solutions, Chapter 16, Christina Turcu editor. Published by Intech, 2010.
4. Schroder, K.A., McCool, S.C., Furlan, W.R., "Broadcast photonic curing of metallic nanoparticle films", Technical Proceedings of the NSTI Nanotechnology Conference and Trade Show, 3, 198-201, 2006.
5. K. A. Schroder, Technical Proceedings of the 2011 NSTI Nanotechnology Conference and Trade Show, 2, 220-223, 2011.
6. Novacentrix, Inc. "SimPulse 3.8 User Guide", Copyright 2011, Novacentrix, Inc. Austin, TX.
7. Salcudean, M., Abdullah, Z., "On the numerical modeling of heat transfer during the solidification process", International Journal for Numerical Methods in Engineering, 25, 445-473, 1988.
8. Voller, V.R., Swaminathan, R., "Fixed grid techniques for phase change problems: A review", International Journal for Numerical Methods in Engineering, 30, 874-898, 1990.
9. Hu, H., Argyropoulos, S.A., "Mathematical modeling of solidification and melting: A review", Modeling in Simulation Science and Engineering, 4, 371-396, 1996.
10. Lapka, P., Furmanski, P., "Numerical modeling of solidification processes of semitransparent materials using the enthalpy and the finite volume methods", Heat Mass Transfer, Vol, 44, 937-957, 2008.
11. Comini, Guidice, D., Lewis, R.W., Zeinkiewicz, O.C., "Finite element solution of non-linear heat conduction problems with special reference to phase change", International Journal for Numerical Methods in Engineering, 13, 1191-1195, 1978.
12. Lemmon, E.C., "Multidimensional integral phase change approximations for finite element conduction codes", Numerical Methods in Heat Transfer, R.W. Lewis, K Morgan, O.C. Zienkiewicz eds., 201-213, 1981.
13. Yang, H., He, Y., "Solving heat transfer problems with phase change via the smoothed effective heat capacity and element free Galerkin methods", International Communications in Heat and Mass Transfer, 37, 385-392, 2010.