Mechanics of interfacial delamination in epidermal electronics systems

Journal of Applied Mechanics, Transactions ASME

Volumn 81, Issue 4, 2014, Pages

  Cheng, Huanyu ^a   Wang, Shuodao ^b  

^a Northwestern University   (United States)

^b University of Illinois at Urbana Champaign   (United States)

Author keywords

Adhesion; Epidermal electronics; Interfacial delamination

Indexed keywords

CONFORMAL CONTACTS; DEVICE OPTIMIZATION; ELECTRONICS SYSTEM; EXTERNAL LOADING; FUTURE DESIGNS; INITIAL CONTACT; INTERFACIAL DELAMINATION; SKIN SURFACES;

ADHESION; DELAMINATION; ELECTROPHYSIOLOGY; VAN DER WAALS FORCES;

LOADING;

EID: 84887225396     PISSN: 00218936     EISSN: 15289036     Source Type: Journal    
DOI: 10.1115/1.4025305     Document Type: Article

References (9)

1. Kim, D.-H., Lu, N., Ma, R., Kim, Y.-S., Kim, R.-H., Wang, S., Wu, J., Won, S. M., Tao, H., Islam, A., Yu, K. J., Kim, T.-I., Chowdhury, R., Ying, M., Xu, L., Li, M., Chung, H.-J., Keum, H., Mccormick, M., Liu, P., Zhang, Y.-W., Omenetto, F. G., Huang, Y., Coleman, T., and Rogers, J. A., 2011, "Epidermal Electronics," Science, 333(6044), pp. 838-843.
2. Hwang, S.-W., Tao, H., Kim, D.-H., Cheng, H., Song, J.-K., Rill, E., Brenckle, M. A., Panilaitis, B., Won, S. M., Kim, Y.-S., Song, Y. M., Yu, K. J., Ameen, A., Li, R., Su, Y., Yang, M., Kaplan, D. L., Zakin, M. R., Slepian, M. J., Huang, Y., Omenetto, F. G., and Rogers, J. A., 2012, "A Physically Transient Form of Silicon Electronics," Science, 337(6102), pp. 1640-1644.
3. Chi, Y. M., Jung, T.-P., and Cauwenberghs, G., 2010, "Dry-Contact and Noncontact Biopotential Electrodes: Methodological Review," IEEE Rev. Biomed. Eng., 3, pp. 106-119.
4. De Luca, C., 2006, "Electromyography," Encyclopedia of Medical Devices and Instrumentation, J. G. Webster, ed., Wiley, New York, pp. 98-109.
5. Chen, C., Tao, W., Su, Y., Wu, J., and Song, J., 2013, "Lateral Buckling of Interconnects in a Noncoplanar Mesh Design for Stretchable Electronics," ASME J. Appl. Mech., 80(4), p. 041031.
6. Lu, B., and Wang, G., 2013, "Surface Effects on the Mechanical Behavior of Buckled Thin Film," ASME J. Appl. Mech., 80(2), p. 021002.
7. Wang, S., Li, M., Wu, J., Kim, D.-H., Lu, N., Su, Y., Kang, Z., Huang, Y., and Rogers, J. A., 2012, "Mechanics of Epidermal Electronics," ASME J. Appl. Mech., 79(3), p. 031022.
8. Xiao, J., Carlson, A., Liu, Z. J., Huang, Y., and Rogers, J. A., 2010, "Analytical and Experimental Studies of the Mechanics of Deformation in a Solid With a Wavy Surface Profile," ASME J. Appl. Mech., 77(1), p. 011003.
9. Frankland, S., Caglar, A., Brenner, D., and Griebel, M., 2002, "Molecular Simulation of the Influence of Chemical Cross-Links on the Shear Strength of Carbon Nanotube-Polymer Interfaces," J. Phys. Chem. B, 106(12), pp. 3046-3048. (Pubitemid 35290253)