Mechanics of epidermal electronics

Journal of Applied Mechanics, Transactions ASME

Volumn 79, Issue 3, 2012, Pages

  Wang, Shuodao ^a   Li, Ming ^a,b   Wu, Jian ^c   Kim, Dae Hyeong ^d   Lu, Nanshu ^e   Su, Yewang ^a   Kang, Zhan ^b   Huang, Yonggang ^a   Rogers, John A ^f,g  

^a Northwestern University   (United States)

^b DALIAN UNIVERSITY OF TECHNOLOGY   (China)

^c TSINGHUA UNIVERSITY   (China)

^d Seoul National University   (South Korea)

^e The University of Texas at Austin   (United States)

^f UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

^g United States of America   (United States)

Author keywords

electronics; epidermis; interfacial contact; work of adhesion

Indexed keywords

DESIGN AND OPTIMIZATION; ELECTRONIC SYSTEMS; EPIDERMIS; EXPERIMENTAL OBSERVATION; HUMAN MACHINE INTERFACE; INTEGRATED ELECTRONICS; INTERFACIAL CONTACT; PREMATURE BABY; ULTRA-THIN; VAN DER WAALS INTERACTIONS; WORK OF ADHESION;

ADHESION; ELECTRONIC EQUIPMENT; FINITE ELEMENT METHOD; MEDICAL APPLICATIONS; VAN DER WAALS FORCES;

ELECTRONICS ENGINEERING;

EID: 84859894436     PISSN: 00218936     EISSN: 15289036     Source Type: Journal    
DOI: 10.1115/1.4005963     Document Type: Article

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