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Volumn 140, Issue , 2013, Pages 128-134

Hydrometallurgical recovery of copper from complex mixtures of end-of-life shredded ICT products

Author keywords

Cu electrowinning; ICT scrap; Metal recovery; Selective leaching

Indexed keywords

AMMONIA LEACHING; AMMONIA-AMMONIUM SULPHATE SOLUTIONS; CURRENT EFFICIENCY; HYDROMETALLURGICAL RECOVERY; ICT SCRAP; INFORMATION AND COMMUNICATIONS TECHNOLOGY; SELECTIVE LEACHING; SOLUTION PURIFICATION;

EID: 84887123794     PISSN: 0304386X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.hydromet.2013.09.012     Document Type: Article
Times cited : (55)

References (9)
  • 1
    • 0345504775 scopus 로고    scopus 로고
    • Hydrometallurgical recovery of metal values from brass melting slag
    • S.M. Abdel Basir, and M.A. Rabah Hydrometallurgical recovery of metal values from brass melting slag Hydrometallurgy 53 1999 31 44
    • (1999) Hydrometallurgy , vol.53 , pp. 31-44
    • Abdel Basir, S.M.1    Rabah, M.A.2
  • 5
    • 33748526503 scopus 로고    scopus 로고
    • Copper leaching behavior from waste printed circuit board in ammoniacal alkaline solution
    • DOI 10.2320/matertrans.47.1788
    • K. Koyama, M. Tanaka, and J.C. Lee Copper leaching behaviour from waste printed circuit board in ammoniacal alkaline solution Mater. Trans. 47 2006 1788 1792 (Pubitemid 44368630)
    • (2006) Materials Transactions , vol.47 , Issue.7 , pp. 1788-1792
    • Koyama, K.1    Tanaka, M.2    Lee, J.-C.3
  • 6
    • 0038515503 scopus 로고    scopus 로고
    • Recovery of copper, tin and lead from the spent nitric etching solutions of printed circuit board and regeneration of the etching solution
    • M.S. Lee, J.G. Ahn, and J.W. Ahn Recovery of copper, tin and lead from the spent nitric etching solutions of printed circuit board and regeneration of the etching solution Hydrometallurgy 70 2003 23 29
    • (2003) Hydrometallurgy , vol.70 , pp. 23-29
    • Lee, M.S.1    Ahn, J.G.2    Ahn, J.W.3
  • 9
    • 34548476295 scopus 로고    scopus 로고
    • Recovery of high purity copper cathode from printed circuit boards using ammoniacal sulfate or chloride solutions
    • DOI 10.1016/j.hydromet.2007.05.010, PII S0304386X07001168
    • T. Oishi, K. Koyama, S. Alam, M. Tanaka, and J.C. Lee Recovery of high purity copper cathode from printed circuit boards using ammoniacal sulfate or chloride solutions Hydrometallurgy 89 2007 82 88 (Pubitemid 47380034)
    • (2007) Hydrometallurgy , vol.89 , Issue.1-2 , pp. 82-88
    • Oishi, T.1    Koyama, K.2    Alam, S.3    Tanaka, M.4    Lee, J.-C.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.