Copper leaching behavior from waste printed circuit board in ammoniacal alkaline solution

Materials Transactions

Volumn 47, Issue 7, 2006, Pages 1788-1792

  Koyama, Kazuya ^a   Tanaka, Mikiya ^a   Lee, Jae Chun ^b  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

^b Korea Institute of Geosceince and Mineral Resources   (South Korea)

Author keywords

Copper recycling; Cupric ammine solution; Cuprous ammine solution; Energy saving; Oxidative leaching; Printed circuit board

Indexed keywords

COMPLEXATION; COPPER; HYDROMETALLURGY; PRINTED CIRCUIT BOARDS; REACTION KINETICS; THERMODYNAMICS;

COPPER RECYCLING; CUPRIC AMMINE SOLUTION; CUPROUS AMMINE SOLUTION; ENERGY-SAVING; OXIDATIVE LEACHING;

LEACHING;

EID: 33748526503     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.47.1788     Document Type: Conference Paper

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