Trends in automotive power semiconductor packaging

Microelectronics Reliability

Volumn 53, Issue 9-11, 2013, Pages 1681-1686

  Dietrich, Peter ^a  

^a Fuji Electric Europe GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC PERFORMANCE; GALLIUM NITRIDES (GAN); JUNCTION TEMPERATURES; MICRO-ELECTRONIC DEVICES; POWER ELECTRONIC DEVICES; POWER ELECTRONIC MODULES; POWER SEMICONDUCTOR PACKAGING; SILICON CARBIDES (SIC);

AUTOMOTIVE INDUSTRY; COMMERCE; ELECTRIC POWER SYSTEMS; GALLIUM NITRIDE; MICROELECTRONICS; SILICON CARBIDE;

STRUCTURE (COMPOSITION);

EID: 84886929877     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2013.07.088     Document Type: Conference Paper

References (10)

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8. Pönicke1 A, Schilm1 J, Triebert1 A, Sempf1 K, Gestrich1 T, Martin1 H-P, Böhm2 G, Schnee3 D. Aktivlöten von Kupfermit ALN -und SIN, Keramische Zeitschrift; 5/2011.
9. Curamik® Ceramic Substrates, specification Si3N4. Version 4.12 EN I 1/2c.
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