A new neural probe using SOI wafers with topological interlocking mechanisms

1st Annual International IEEE-EMBS Special Topic Conference on Microtechnologies in Medicine and Biology - Proceedings

Volumn , Issue , 2000, Pages 507-511

  Cheung, Karen ^a,b   Lee, Gun ^b   Djupsund, Kaj ^a   Dan, Yang ^a   Lee, Luke P ^a,b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b University of California at Berkeley   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CHEMICAL MODIFICATION; MICROELECTRODES; PROBES; SIGNAL TO NOISE RATIO; SILICON; SINGLE CRYSTALS; STRESSES; TISSUE; TOPOLOGY;

ELECTRICAL STIMULATIONS; MECHANICAL ANCHORING; MULTIELECTRODE ARRAYS; ROBUST MECHANISMS; SILICON SURFACES; SINGLE CRYSTAL SILICON; TOPOLOGICAL DESIGN; TOPOLOGICAL INTERLOCKING;

SILICON WAFERS;

EID: 84886753646     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MMB.2000.893836     Document Type: Conference Paper

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