Stable colloidal copper nanoparticles for a nanofluid: Production and application

Colloids and Surfaces A: Physicochemical and Engineering Aspects

Volumn 441, Issue , 2014, Pages 589-597

  Gurav, Prasad ^a   Naik, S Srinu ^a   Ansari, Komel ^a   Srinath, S ^a   Kishore, K Anand ^a   Setty, Y Pydi ^a   Sonawane, Shirish ^a  

^a NATIONAL INSTITUTE OF TECHNOLOGY   (India)

Author keywords

Colloidal copper nanoparticles; Convective heat transfer; Heat transfer coefficient; Nanofluid

Indexed keywords

COPPER; HEAT CONVECTION; HEAT FLUX; HEAT TRANSFER COEFFICIENTS; LAMINAR FLOW; METAL NANOPARTICLES; REYNOLDS NUMBER; SYNTHESIS (CHEMICAL);

COLLOIDAL NANOPARTICLES; CONSTANT HEAT FLUX; CONVECTIVE HEAT TRANSFER; COPPER NANOPARTICLES; HEAT TRANSFER ANALYSIS; HEAT TRANSFER CHARACTERISTICS; LAMINAR FLOW REGIMES; NANOFLUIDS;

NANOFLUIDICS;

COPPER; COPPER NANOPARTICLE; NANOPARTICLE; WATER;

ARTICLE; COLLOID; HEAT TRANSFER; NANOFLUIDICS; PHYSICAL CHEMISTRY; PRIORITY JOURNAL; SYNTHESIS; THERMAL CONDUCTIVITY; VISCOSITY; X RAY DIFFRACTION;

EID: 84886688822     PISSN: 09277757     EISSN: 18734359     Source Type: Journal    
DOI: 10.1016/j.colsurfa.2013.10.026     Document Type: Article

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