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Volumn 50, Issue 1, 2013, Pages 763-770

Thermal performance of screen mesh wick heat pipes using water-based copper nanofluids

Author keywords

Cu distilled water nanofluids; Cylindrical heat pipes; Nanoparticle coating layer; Screen mesh wick; Thermal resistance

Indexed keywords

ANGULAR POSITIONS; CU LAYERS; DISTILLED WATER; EVAPORATOR SECTION; INPUT POWER; MINIMUM VALUE; NANOFLUIDS; NANOPARTICLE COATINGS; SCREEN MESH WICK; SURFACTANT-FREE; TEST SECTIONS; THERMAL PERFORMANCE; WALL TEMPERATURES; WALL-TEMPERATURE DISTRIBUTION; WATER BASED; WATER NANOFLUIDS; WORKING FLUID;

EID: 84866556696     PISSN: 13594311     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.applthermaleng.2012.06.049     Document Type: Conference Paper
Times cited : (145)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.