Wafer level fabrication of vibrational energy harvesters using bulk PZT sheets

Procedia Engineering

Volumn 47, Issue , 2012, Pages 1041-1044

  Janphuang, P ^a   Lockhart, R ^a   Briand, D ^a   De Rooij, N F ^a  

^a EPFL   (Switzerland)

Author keywords

Bonding; Bulk pzt sheets; Vibration energy harvesting; Wefer level fabrication

Indexed keywords

EID: 84885961389     PISSN: 18777058     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1016/j.proeng.2012.09.328     Document Type: Conference Paper

References (5)

1. Beeby SP, Tudor MJ, White NM. Energy harvesting vibration sources for microsystems application. Measurement Science and Technology 2006;17:R175-95.
2. Muralt P, Polcawich RG, Trolier-McKinstry S. Piezoelectric thin films for sensors, actuators, and energy harvesting. MRS Bulletin 2009;35:658-664.
3. Lei A, Xu R, Thyssen A, Stoot AC, Christiansen TL, Hansen K, Lou-Moller R, Thomsen EV. MEMS-based thick film PZT vibrational energy harvester. Proc. MEM 2011; 125-128.
4. Aktakka EE, Rebecca LP, Najafi K. Thinned-PZT in SOI process and design optimization for piezoelectric inertial energy harvesting. Proc. Trnasducers 2011; 1649-1652.
5. Kamel TM, Elfrink R, Renaud M, Hohlfeld D, Goedbloed M, de Nooijer C, Jambunathan M, van Schaijk R: Modeling and Characterization of MEMS-based piezoelectric harvesting devices. Journal of Micromechanics and Microengineering 2010; 20:105023-037.