On the homogenization of the thickness of Cu deposits by means of MHD convection within small dimension cells

Electrochemistry Communications

Volumn 36, Issue , 2013, Pages 80-83

  Muhlenhoff S ^a   Mutschke, G ^b,c   Uhlemann, M ^a   Yang, X ^b   Odenbach, S ^b   Frohlich J ^b   Eckert, K ^b  

^a IFW DRESDEN   (Germany)

^b DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

^c INSTITUTE OF ION BEAM PHYSICS AND MATERIALS RESEARCH   (Germany)

Author keywords

Electrochemical deposition; Forced convection; Lorentz force; Magnetoelectrochemistry; Mass transport; MHD

Indexed keywords

DEPOSIT THICKNESS; ELECTROCHEMICAL DEPOSITION; INHOMOGENEITIES; MAGNETIC GRADIENT FIELD; MAGNETOELECTROCHEMISTRY; MHD CONVECTION; VERTICAL PLANE; VORTICAL MOTION;

COPPER DEPOSITS; DEPOSITION; ELECTRODEPOSITION; FORCED CONVECTION; MAGNETOHYDRODYNAMICS; MASS TRANSFER; NATURAL CONVECTION; REDUCTION;

LORENTZ FORCE;

EID: 84885348113     PISSN: 13882481     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.elecom.2013.09.025     Document Type: Article

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