Innovative process chain for the development of wear resistant 3D metal microsystems

Microelectronic Engineering

Volumn 110, Issue , 2013, Pages 392-397

  Richter, Claudia ^a   Stegemann, Daniel ^a   Vierheller, Anke ^a   Gothsch, Thomas ^a   Finke, Jan Henrik ^a   Kwade, Arno ^a   Müller Goymann, Christel Charlotte ^a   Dietzel, Andreas ^a   Büttgenbach, Stephanus ^a  

^a TECHNICAL UNIVERSITY OF BRAUNSCHWEIG   (Germany)

Author keywords

Die sinking microelectrical discharge machining; Dispersion; Electrochemical polishing; High pressure homogenization; Microelectrical discharge machining; Microelectrical discharge milling

Indexed keywords

CHAINS; DISPERSION (WAVES); ELECTROLYTIC POLISHING; EMULSIFICATION; FABRICATION; MICROSYSTEMS; MILLING (MACHINING); PARTICLE SIZE; POLISHING; STAINLESS STEEL; SURFACE ROUGHNESS;

3-D MICROSYSTEMS; DRUG CARRIER SYSTEMS; FABRICATION PROCESS; HIGH PRESSURE HOMOGENIZATION; INNOVATIVE PROCESS; MEAN PARTICLE SIZE; MICRO ELECTRICAL DISCHARGE MACHINING; SOLID LIPID NANOPARTICLE (SLN);

ELECTRIC DISCHARGES;

EID: 84885182295     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2013.02.078     Document Type: Article

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