The effect of PECVD plasma decomposition on the wettability and dielectric constant changes in silicon modified DLC films for potential MEMS and low stiction applications

AIP Advances

Volumn 2, Issue 3, 2012, Pages

  Ogwu, A A ^a   Okpalugo, T I T ^a,b   McLaughlin, J A D ^b  

^a UNIVERSITY OF THE WEST OF SCOTLAND   (United Kingdom)

^b UNIVERSITY OF ULSTER   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS CARBON; AMORPHOUS SILICON; CONTACT ANGLE; FOURIER TRANSFORM INFRARED SPECTROSCOPY; HYDROGENATION; HYDROPHOBICITY; SILICON; SPECTROSCOPIC ANALYSIS; SPECTROSCOPIC ELLIPSOMETRY; STICTION; X RAY PHOTOELECTRON SPECTROSCOPY;

DIELECTRIC-CONSTANT MEASUREMENTS; HYDROGENATED AMORPHOUS CARBON FILMS; HYDROPHOBIC CHEMICALS; HYDROPHOBIC ENTITIES; PLASMA CHEMISTRIES; PLASMA DECOMPOSITION; SURFACE CHEMICALS; WATER CONTACT ANGLE;

CARBON FILMS;

EID: 84885034051     PISSN: None     EISSN: 21583226     Source Type: Journal    
DOI: 10.1063/1.4742852     Document Type: Article

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