New aspects of simulation in hot-embossing

DTIP 2003 - Design, Test, Integration and Packaging of MEMS/MOEMS 2003

Volumn , Issue , 2003, Pages 272-274

  Worgull, M ^a   Heckele, M ^a  

^a KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

Author keywords

Application software; Compression molding; Computational modeling; Embossing; Filling; Injection molding; Polymers; Softening; Software tools; Temperature

Indexed keywords

EID: 84884867635     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/DTIP.2003.1287051     Document Type: Conference Paper

References (1)

1. Heckele, M., W. Bacher, and K.D. Müller, Hot embossing - The molding technique for plastic microstructures. Microsystem Technologies, 1998. 4(3): pp. 122-124.