Effects of passivation on the properties of Ni-P alloy coating deposited on CFs reinforced PEEK

Surface and Coatings Technology

Volumn 232, Issue , 2013, Pages 269-274

  Zhou, Baiyu ^a   Kong, Lingwei ^a   Niu, Liyuan ^b   Lian, Jianshe ^a   Li, Guangyu ^a  

^a JILIN UNIVERSITY   (China)

^b Zhejiang Industry and Trade Polytechnic   (China)

Author keywords

Corrosion resistance; Electroless deposition; Electromagnetic interference shielding effectiveness; Oxidation behavior; Passivation

Indexed keywords

ELECTROCHEMICAL TEST; ELECTROLESS NI-P; ELECTROMAGNETIC INTERFERENCE SHIELDING EFFECTIVENESS; NI-P ALLOY COATINGS; OXIDATION BEHAVIORS; OXIDATION ENVIRONMENT; POLYETHER ETHER KETONES (PEEK); SHIELDING MATERIALS;

CHROMATE COATINGS; CORROSION RESISTANCE; ELECTROLESS PLATING; ELECTROMAGNETIC PULSE; ELECTROMAGNETIC WAVE INTERFERENCE; MAGNETIC SHIELDING; METAL CLADDING; OXIDATION; PASSIVATION; PHOTOELECTRONS; REINFORCEMENT; SCANNING ELECTRON MICROSCOPY; SIGNAL INTERFERENCE; X RAY DIFFRACTION ANALYSIS; X RAY PHOTOELECTRON SPECTROSCOPY;

NICKEL;

EID: 84883447670     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2013.05.031     Document Type: Article

References (27)

1. Ott H.W. Noise Reduction Techniques in Electronic Systems 1988, John Wiley & Sons. second ed.
2. Huang C.Y., Mo W.W. Surf. Coat. Technol. 2002, 154:55.
3. Huang C.Y., Pai J.F. Eur. Polym. J. 1998, 34:261.
4. Huang C.Y. CC Wu. Eur. Polym. J. 2000, 36:2729.
5. Tzeng S.S., Chang F.Y. Mater. Sci. Eng., A 2001, 302:258.
6. Huang C.Y., Mo W.W., Roan M.L. Surf. Coat. Technol. 2004, 184:123.
7. Schulz U., Kaiser N. Prog. Surf. Sci. 2006, 81:387.
8. Yip J., Jiang S., Wong C. Surf. Coat. Technol. 2009, 204:380.
9. Wei Q., Xiao X., Hou D., Ye H., Huang F. Surf. Coat. Technol. 2008, 202:2535.
10. Li D., Goodwin K., Yang C.L. J. Mater. Sci. 2008, 43:7121. (Wiley & Sons, 1988).
11. Electroless Plating: Fundamentals and Applications 1990, 261. AESF Publishing, Orlando, FL. G.O. Mallory, J.B. Hajdu (Eds.).
12. Yan H. New Techniques in Electroless Ni and Composite Plating 2001, 1. Industry of National Defense Press, Beijing.
13. Brenner A., Riddel G. J. Res. Nat. Bun. Stds. 1946, 37:31.
14. Riedel W. Electroless Ni Plating 1991, 1. ASM International, Finishing Publications.
15. Huang C.Y., Mo W.W., Roan M.L. Surf. Coat. Technol. 2004, 184:163.
16. Jiang S.X., Guo R.H. Surf. Coat. Technol. 2011, 205:4274.
17. Nagasawa C., Kumagai Y., Urabe K., Shinagawa S. J. Porous Mat. 1999, 6:247.
18. Brown R.J.C., Milton M.J.T. J. Mater. Chem. 2002, 12:2749.
19. Cui G., Li N., Li D., Zheng J., Wu Q. Surf. Coat. Technol. 2006, 200:6808.
20. Saxena V., Rani R.U., Sharma A.K. Surf. Coat. Technol. 2006, 201:855.
21. Liu Y., Beckett D., Hawthorne D. Appl. Surf. Sci. 2011, 257:4486.
22. Uma Rani R., Sharma A.K., Minu C., Poornima G., Tejaswi S. J. Appl. Electrochem. 2010, 40:333.
23. Mu S., Li N., Li D., Zou Z. Electrochim. Acta 2009, 54:6718.
24. Mu S., Li N., Li D., Xu L. Appl. Surf. Sci. 2010, 256:4089.
25. Kulinich S.A., Akhtar A.S., Susac D., Wong P.C., Wong K.C., Mitchell K.A.R. Appl. Surf. Sci. 2007, 253:3144.
26. Raeissi K., Toroghinejad M.R. Prog. Org. Coat. 2008, 62:61.
27. Chung D. Carbon 2001, 39:279.