Anti-counterfeit, miniaturized, and advanced electronic substrates for medical device applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2013, Pages 523-528

  Das, Rabindra N ^a   Egitto, Frank D ^a   Lin, How ^a  

^a Endicott Interconnect Technologies Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADVANCED PACKAGING; ELECTRONIC SUBSTRATES; EMBEDDED PASSIVES; EMBEDDED SIGNATURES; HIGH DENSITY INTERCONNECTS; HIGH-SPEED PERFORMANCE; MINIATURIZED ELECTRONICS; SUBSTRATE TECHNOLOGY;

BIOMEDICAL EQUIPMENT; CHIP SCALE PACKAGES; CRIME; TECHNOLOGY; THERMOELECTRIC EQUIPMENT;

SUBSTRATES;

EID: 84883360347     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2013.6575622     Document Type: Conference Paper

References (4)

1. http://www.who.int/impact/en/
2. F.D. Egitto, S.R. Krasniak, K.J. Blackwell, and S.G. Rosser, "Z-Axis Interconnection for Enhanced Wiring in Organic Laminate Electronic Packages," Proceedings Fifty-Fifth Electronic Components and Technology Conference, May 31 to June 3, 2005, Lake Buena Vista, FL (IEEE, Piscataway, NJ, USA), p. 1132
3. Steven G. Rosser, Irving Memis and Harry Von Hofen, "Migrating Printed Wiring Board Assemblies into System in a Package (SiP) IMAPS 41st International Symposium on Microelectronics, November 2008
4. Rabindra N. Das, Frank D. Egitto, Barry Bonitz, Mark D. Poliks, and Voya R. Markovich, "Package-Interposer-Package (PIP): A Breakthrough Package-on-Package (PoP) Technology for High End Electronics" 61st Electronic Components and Technology Conference proceedings, (June 1-4, 2011).