Enhanced thermal transport of hexagonal boron nitride filled polymer composite by magnetic field-assisted alignment

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2013, Pages 1692-1696

  Lin, Ziyin ^a   Liu, Yan ^a   Moon, Kyoung Sik ^a   Wong, Ching Ping ^a,b  

^a Georgia Institute of Technology   (United States)

^b CHINESE UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

EFFECTIVE MEDIUM APPROXIMATION; ENHANCED THERMAL CONDUCTIVITY; EXTERNAL MAGNETIC FIELD; FILLED POLYMER COMPOSITES; HEXAGONAL BORON NITRIDE (H-BN); HIGH THERMAL CONDUCTIVITY; LINEAR COEFFICIENT OF THERMAL EXPANSION; SUPERPARAMAGNETIC IRON OXIDE NANOPARTICLES;

BORON NITRIDE; COMPOSITE MATERIALS; ELECTRONICS PACKAGING; EPOXY RESINS; MAGNETIC FIELDS; MECHANICAL PROPERTIES;

THERMAL CONDUCTIVITY;

EID: 84883354832     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2013.6575801     Document Type: Conference Paper

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