Total cost effective scallop free Si etching for 2.5D & 3D TSV fabrication technologies in 300mm wafer

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2013, Pages 605-607

  Morikawa, Yasuhiro ^a   Murayama, Takahide ^a   Sakuishi, Yuu Nakamuta Toshiyuki ^a   Suzuki, Akiyoshi ^a   Suu, Koukou ^a  

^a ULVAC INC   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROCHEMICAL PLATING; FABRICATION TECHNOLOGIES; HIGH FREQUENCY DEVICES; HIGH-SPEED OPERATION; LOW-POWER CONSUMPTION; PARALLEL PROCESSING; PLATING BATH TECHNOLOGY; VAPOR DEPOSITION POLYMERIZATION;

COSTS; ETCHING; MOLLUSCS; SHELLFISH; SILICON; THREE DIMENSIONAL;

TECHNOLOGY;

EID: 84883327171     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2013.6575636     Document Type: Conference Paper

References (2)

1. Y. Morikawa, et al., "Scallop Free TSV Etching Method For 3-D LSI Integration" Proceedings of Int. Symp. on AVS 57th, Albuquerque, New Mexico, Nov. 1, 2010, p 121
2. Y. Morikawa, et al., "A Novel Scallop Free TSV Etching Method In Magnetic Neutral Loop Discharge Plasma" in Proc. IEEE Electronic Components and Technol. Conf. (ECTC), San Diego, CA, May 29-June 1, 2012, pp. 794-795.