Interface material mixing formed by the deposition of copper on aluminum by means of the cold spray process

Journal of Thermal Spray Technology

Volumn 14, Issue 3, 2005, Pages 330-334

  Champagne Jr , Victor K ^a   Helfritch, Dennis ^a   Leyman, Phillip ^a   Grendahl, Scott ^a   Klotz, Brad ^a  

^a U S ARMY RESEARCH LABORATORY   (United States)

Author keywords

Bond strength; Coatings; Cold spray

Indexed keywords

ALUMINUM; BOND STRENGTH (MATERIALS); COPPER; DEPOSITION; INTERFACES (MATERIALS); MATHEMATICAL MODELS; MECHANICAL VARIABLES MEASUREMENT; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SPRAYING;

BALLISTIC MODEL; COLD SPRAY; FIELD EMISSION SCANNING ELECTRON MICROSCOPE (FSEM);

SPRAYED COATINGS;

EID: 27744491529     PISSN: 10599630     EISSN: None     Source Type: Journal    
DOI: 10.1361/105996305X59332     Document Type: Review

References (9)

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