Crack propagation and fracture in silicon wafers under thermal stress

Journal of Applied Crystallography

Volumn 46, Issue 4, 2013, Pages 849-855

  Danilewsky, Andreas ^a   Wittge, Jochen ^a   Kiefl, Konstantin ^a   Allen, David ^b   McNally, Patrick ^b   Garagorri, Jorge ^c   Elizalde, M Reyes ^c   Baumbach, Tilo ^d   Tanner, Brian K ^e  

^a UNIVERSITY OF FREIBURG   (Germany)

^b DUBLIN CITY UNIVERSITY   (Ireland)

^c UNIVERSITY OF NAVARRA   (Spain)

^d KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

^e DURHAM UNIVERSITY   (United Kingdom)

Author keywords

in situ observations; microcracks; silicon wafer fracture; X ray diffraction imaging

Indexed keywords

DIFFRACTION IMAGES; GEOMETRICAL DIMENSIONS; IN-SITU OBSERVATIONS; SITU X-RAY DIFFRACTION; TEMPERATURE WINDOW; THERMAL-ANNEALING; WAFER FRACTURES; X-RAY DIFFRACTION IMAGING;

CRACK PROPAGATION; CRACK TIPS; FRACTURE; MICROCRACKING; MICROCRACKS; SILICON; THERMAL STRESS; X RAY DIFFRACTION;

SILICON WAFERS;

EID: 84880555361     PISSN: 00218898     EISSN: 16005767     Source Type: Journal    
DOI: 10.1107/S0021889813003695     Document Type: Article

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