Enhanced electrical and mechanical properties of silver nanoplatelet-based conductive features direct printed on a flexible substrate

ACS Applied Materials and Interfaces

Volumn 5, Issue 13, 2013, Pages 5908-5913

  Lee, Young In ^a   Kim, Seil ^b   Jung, Seung Boo ^c   Myung, Nosang V ^a   Choa, Yong Ho ^b  

^a University of California Riverside   (United States)

^b Hanyang University   (South Korea)

^c Sungkyunkwan University   (South Korea)

Author keywords

conductive features; direct printing; flexible substrates; mechanical properties; silver nanoplatelets

Indexed keywords

CONDUCTIVE FEATURES; CONDUCTIVE PATTERNS; CONDUCTIVE SILVER PATTERNS; DIRECT PRINTING; ELECTRICAL AND MECHANICAL PROPERTIES; FLEXIBLE SUBSTRATE; NANO-PLATELETS; PARTICLE DISPERSION;

BENDING STRENGTH; CONDUCTIVE MATERIALS; ELECTRIC CONDUCTIVITY; MECHANICAL PROPERTIES; MICROSTRUCTURE; POLYMERIC FILMS; PRINTING; SINTERING; SUBSTRATES;

SILVER;

EID: 84880073884     PISSN: 19448244     EISSN: 19448252     Source Type: Journal    
DOI: 10.1021/am401757y     Document Type: Article

References (37)

1. Ho, C. C.; Evans, J. W.; Wright, P. K. J. Micromech. Microeng. 2010, 20, 104009
2. Kuhn, M.; Napporn, T.; Meunier, M.; Vengallatore, S.; Therriault, D. J. Micromech. Microeng. 2008, 18, 015005
3. Puetz, J.; Aegeter, M. A. Thin Solid Films 2008, 516, 4495-4501
4. Voigt, M. M.; Guite, A.; Chung, D.-Y.; Khan, R. U. A.; Campbell, A. J.; Bradley, D. D. C.; Meng, F.; Steinke, J. H. G.; Tierney, S.; McCulloch, I.; Penxten, H.; Lutsen, L.; Douheret, O.; Manca, J.; Brokmann, U.; Sonnichsen, K.; Hulsenberg, D.; Bock, W.; Barron, C.; Blanckaert, N.; Springer, S.; Grupp, J.; Mosley, A. Adv. Funct. Mater. 2010, 20, 239-246
5. Huebner, C. F.; Carroll, J. B.; Evanoff, D. D.; Ying, Y.; Stevenson, B. J.; Lawrence, J. R.; Houchins, J. M.; Foguth, A. L.; Sperryb, J.; Foulge, S. H. J. Mater. Chem. 2008, 18, 4942-4948
6. Singh, M.; Haverinen, H. M.; Dhagat, P.; Jabbour, G. E. Adv. Mater. 2010, 22, 673-685
7. Minemawari, H.; Yamada, T.; Matsui, H.; Tsutsumi, J.; Haas, S.; Chiba, R.; Kumai1, R.; Hasegawa, T. Nature 2011, 475, 364-367
8. Vaseem, M.; Lee, K. M.; Hong, A.-R.; Hahn, Y.-B. ACS Appl. Mater. Interfaces 2012, 4, 3300-3307
9. Jang, S.; Seo, Y.; Choi, J.; Kim, T.; Cho, J.; Kim, S.; Kim, D. Scr. Mater. 2010, 62, 258-261
10. Osch, T. H. J.; Perelaer, J.; Laat, A. W. M.; Schubert, U. S. Adv. Mater. 2008, 20, 343-345
11. Perelaer, J.; Hendriks, C. E.; Laat, A. W. M.; Schubert, U. S. Nanotechnology 2009, 20, 165303
12. Siegel, C.; Phillips, S, T.; Dickey, M, D.; Lu, N.; Suo, Z.; Whitesides, G. M. Adv. Funct. Mater. 2010, 20, 28-35
13. Chen, Y.; Au, J.; Kazlas, P.; Ritenour, A.; Gates, H.; McCreary, M. Nature 2003, 423, 136
14. Krebs, F. C.; Jørgensen, M.; Norrman, K.; Hagemann, O.; Alstrup, J.; Nielsen, T. D.; Fyenbo, J.; Larsen, K.; Kristensen, J. Sol. Energy Mater. Sol. Cells 2009, 93, 422-441
15. Komoda, N.; Nogi, M.; Suganuma, K.; Otsuka, K. ACS Appl. Mater. Interfaces 2012, 4, 5732-5736
16. Dua, V.; Surwade, S. P.; Ammu, S.; Agnihotra, S. R.; Jain, S.; Roberts, K. E.; Park, S.; Ruoff, R. S.; Manohar, S. K. Angew. Chem., Int. Ed. 2010, 49, 2154-2157
17. Lee, Y.; Choi, J.; Lee, K. J.; Stott, N. E.; Kim, D. Nanotechnology 2008, 19, 415604
18. Grouchko, M.; Kamyshny, A.; Magdassi, S. J. Mater. Chem. 2009, 19, 3057-3062
19. Ahn, B. Y.; Duoss, E. B.; Motala, M. J.; Guo, X.; Park, S.-I.; Xiong, Y.; Yoon, J.; Nuzzo, R. G.; Rogers, J. A.; Lewis, J. A. Science 2009, 323, 1590-1593
20. Greer, J. R.; Street, R. A. Acta Mater. 2007, 55, 6345-6349
21. Jung, J.; Kang, S. J. Am. Ceram. Soc. 2005, 88, 3032-3036
22. Park, B. K.; Kim, D.; Jeong, S.; Moon, J.; Kim, J. S. Thin Solid Films 2007, 515, 7706-7711
23. Luechinger, N. A.; Athanassiou, E. K.; Stark, W. J. Nanotechnology 2008, 19, 445201
24. Chen, S.; Carroll, D. L. Nano Lett. 2002, 2, 1003-1007
25. Hao, E.; Kelly, K. L.; Hupp, J. T.; Schatz, G. C. J. Am. Chem. Soc. 2002, 124, 15182-15183
26. Maillard, M.; Huang, P.; Brus, L. Nano Lett. 2003, 3, 1611-1615
27. Lu, Q.; Lee, K.-J.; Lee, K.-B.; Kim, H.-T.; Lee, J.; Myung, N. V.; Choa, Y.-H. J. Colloid Interface Sci. 2010, 342, 8-17
28. Meng, L.; Lu, P.; Li, S.; Zhao, J.; Li, T. Powder Technol. 2012, 228, 284-294
29. Roberts, J. N.; Schwartz, L. M. Phys. Rev. B 1985, 31, 5990-5997
30. McLachlan, D. S.; Blaszkiewicz, M.; Newnham, R. E. J. Am. Ceram. Soc. 1990, 73, 2187-2203
31. Tai, Y.-L.; Yang, Z.-G. J. Mater. Chem. 2011, 21, 5938-5943
32. Lee, H.-H.; Chou, K.-S.; Huang, K.-C. Nanotechnology 2005, 16, 2436-2441
33. Zhang, Z.; Zhang, X.; Xin, Z.; Deng, M.; Wen, Y.; Song, Y. Nanotechnology 2011, 22, 425601
34. Komoda, N.; Nogi, M.; Suganuma, K.; Kohno, K.; Akiyama, Y.; Otsuka, K. Nanoscale 2012, 4, 3418
35. Perelaer, J.; Smith, P. J.; Mager, D.; Soltman, D.; Volkman, S. K.; Subramanian, V.; Korvink, J. G.; Schubert, U. S. J. Mater. Chem 2010, 20, 8446
36. Magdassi, S.; Grouchko, M.; Berezin, O.; Kamyshny, A. ACS Nano 2010, 4, 1943
37. Deng, D.; Jin, Y.; Cheng, Y.; Qi, T.; Xiao, F. ACS Appl. Mater. Interfaces 2013, 5, 3839