Design and characterization of a biocompatible packaging concept for implantable electronic devices

44th International Symposium on Microelectronics 2011, IMAPS 2011

Volumn 1, Issue , 2011, Pages 152-160

  De Beeck, Maaike Op ^a   Qian, Karen ^a   Fiorini, Paolo ^a   Malachowski, Karl ^a   Van Hoof, Chris ^a  

^a IMEC   (Belgium)

Author keywords

Biocompatibility; Biomedical device; Hermeticity; Implantable packaging

Indexed keywords

BIOCOMPATIBLE ELASTOMERS; BIOCOMPATIBLE PACKAGING; BIOMEDICAL DEVICES; DIFFUSION BARRIER PROPERTY; FABRICATION TECHNIQUE; HERMETICITY; IMPLANTABLE ELECTRONIC DEVICES; MECHANICAL SUPPORT;

BIOCOMPATIBILITY; CHARACTERIZATION; CONDUCTIVE MATERIALS; CORROSION; DIFFUSION BARRIERS; METALLIZING; MICROELECTRONICS;

CHIP SCALE PACKAGES;

EID: 84879970812     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. G. Kotzar, M. Freas, et al, "Evaluation of MEMS materials of construction for implantable medical devices", Biomaterials, 23, 2002, pp. 2737-2750.
2. Brochure from ASM International, "Materials and Coating for medical devices: cardiovascular" 2009, pp. 124-127
3. J. Sarna, R. Kustosz, R. Major, J.M. Lackner, B. Major, "Polish Artificial Heart-new coatings, technology, diagnostics" Bull. Pol. Ac.: Tech., 58, 2010, pp. 329-335
4. E. Dy, R. Vos, J. Rip, A. L. Manna, M. Op de Beeck, " Biocompatibility Assessment of Advanced Wafer-level based Chip Encapsulation", Proc. of ESTC conference, Sept. 2010.
5. P. Singh and P. Viswanadham, "Failure Modes and Mechanisms in Electronic Packages". New York: Springer-Verlag, 1997, p. 287
6. M. Bariatto Fontes et al. 'Tuning Electrode Impedance for the Electrical Recording of Biopotentials', IEEE-EMBC conference, August 2010, Buenos Aires.