Lead-free electrical conductive adhesives for solar cell interconnectors

Conference Record of the IEEE Photovoltaic Specialists Conference

Volumn , Issue , 2008, Pages

  Schwertheim, S ^a   Scherff, M ^a,b   Mueller, T ^a   Fahrner, W R ^a   Neitzert, H C ^c  

^a UNIVERSITY OF HAGEN   (Germany)

^b Q Cells AG   (Germany)

^c UNIVERSITY OF SALERNO   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE ADHESIVE; CONTACT FORMATION; ELECTRICAL CONDUCTIVE ADHESIVES; ELECTRICALLY CONDUCTIVE ADHESIVES; INTERCONNECTORS; LEAD-FREE; SOLDER JOINTS;

ELECTRIC PROPERTIES;

EID: 84879717053     PISSN: 01608371     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/PVSC.2008.4922588     Document Type: Conference Paper

References (6)

1. M. Taguchi et al., "An Approach for the higher Efficiency in the HIT Cells", 31th IEEE PVSC, 2005, pp. 866.
2. M. Scherff et al., "Dependency of Heterojunction Solar Cell Efficiency on the Indium Tin Oxide Deposition Parameters", 20th European PVSECE, 2005, pp. 960.
3. S. K. Kang et al., "Development of High Conduc-tivity Lead (Pb)-Free Conducting Adhesives", Transactions on Components, Packag. Manuf. Tech. A, 21 (1), 1998, pp. 18-22.
4. H. H. Berger, "Contact Resistance and Contact Resistivity", J. Electrochem. Soc., 119 (4), 1972, pp. 507-514.
5. M. Scherff et al., "Electrical properties of 10 x 10 cm2 HIT solar cells with screen-printed metal grids manufactured on textured p-type mc-Si substrates", 15th International PVSEC, 2005, pp. 991.
6. B. Beier et al., "Electrically Conductive Adhesives: A Novel Reliable Methode for Interconnecting Crys-talline Silicon Solar Cells", 17th European PVSECE, 2001, pp. 812-815.