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Journal of Materials Science: Materials in Electronics

Volumn 24, Issue 7, 2013, Pages 2211-2217

Electroless copper plating on 1,2-ethylenediamine grafted poly(ethyleneterepthalate) for the fabrication of flexible copper clad laminate

(3) Xue, Longlong a Liang, Qian a Lu, Yinxiang a

a FUDAN UNIVERSITY (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE INTER LAYERS; ATOMIC FORCE MICROSCOPE (AFM); ATTENUATED TOTAL REFLECTIONS; DIMETHYL SULFOXIDE (DMSO); ELECTROLESS COPPER PLATING; FLEXIBLE COPPER CLAD LAMINATE; FOURIER TRANSFORMATIONS; WATER CONTACT ANGLE;

ATOMIC FORCE MICROSCOPY; CONTACT ANGLE; COPPER; COPPER PLATING; DIMETHYL SULFOXIDE; ELECTROLESS PLATING; ETHANOL; FOURIER TRANSFORMS; GRAFTING (CHEMICAL); PHOTOELECTRONS; SURFACE ROUGHNESS; X RAY PHOTOELECTRON SPECTROSCOPY;

ORGANIC SOLVENTS;

EID: 84879411478 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-013-1081-x Document Type: Article

Times cited : (16)

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