SCOPUS 정보 검색 플랫폼

Volumn 278, Issue , 2013, Pages 219-222

Fabrication of contact holes by rear side laser ablation of polyimide foils for CIGS solar modules

(7) Ehrhardt, Martin a Scheit, Christian b Ragnow, Steffen b Lorenz, Pierre a Wehrmann, Anja a Braun, Alexander b Zimmer, Klaus a

a LEIBNIZ INSTITUTE OF SURFACE ENGINEERING IOM (Germany)

b Solarion AG (Germany)

Author keywords

CIGS; Contact resistance; Laser; Laser ablation; Polyimide; Serial interconnection; Solar module

Indexed keywords

ABLATION; CONTACT RESISTANCE; COPPER COMPOUNDS; FABRICATION; FLEXIBLE ELECTRONICS; GALLIUM COMPOUNDS; INDIUM COMPOUNDS; LASER ABLATION; LASERS; OPEN CIRCUIT VOLTAGE; POLYIMIDES; SELENIUM COMPOUNDS; SILVER; SOLAR CELL ARRAYS; THIN FILM SOLAR CELLS;

CIGS; CONDUCTIVE ADHESIVE; COPPER INDIUM GALLIUM DISELENIDE; ELECTRONIC APPLICATION; MECHANICAL FLEXIBILITY; MECHANICAL INTERCONNECTIONS; SERIAL INTERCONNECTION; SOLAR MODULE;

SOLAR CELLS;

EID: 84878549171 PISSN: 01694332 EISSN: None Source Type: Journal
DOI: 10.1016/j.apsusc.2013.01.049 Document Type: Conference Paper

Times cited : (5)

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