Deposition of conductive materials on textile and polymeric flexible substrates

Journal of Materials Science: Materials in Electronics

Volumn 24, Issue 2, 2013, Pages 635-643

  Lacerda Silva, N ^a   Goncalves L M ^a   Carvalho, H ^a  

^a UNIVERSITY OF MINHO   (Portugal)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CONDUCTIVE FILMS; FLEXIBLE ELECTRONICS; METALLIC FILMS; PHYSICAL VAPOR DEPOSITION; POLYIMIDES; POLYVINYL CHLORIDES; SOLAR ENERGY; TEXTILES; THERMAL EVAPORATION; WEAVING;

CHEMICAL COMPOSITIONS; ELECTRICAL RESISTANCES; FLEXIBLE SUBSTRATE; MECHANICAL AND ELECTRICAL PROPERTIES; MECHANICAL BEHAVIOUR; PHYSICAL VAPOUR DEPOSITION; SUBSTRATE MATERIAL; TEXTILE SUBSTRATES;

SUBSTRATES;

EID: 84878544888     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-012-0781-y     Document Type: Article

References (30)

1. G. Sabine, U. Möhring, H. Müller, A. Neudeck, W. Scheibner, Textile based electronic substrate technology. J. Ind. Text. 33(3), 179-189 (2004)
2. E.R. Post, M. Orth, P.R. Russo, N. Gershenfeld, E-broidery: Design and Fabrication of textile-based computing. IBM Syst. J. 39, 3-4 (2000)
3. J. Ottenbacher, S. Römer, C. Kunze, U. Großmann, W. Stork, Integration of a bluetooth based ECG system into clothing, in Proceedings of the Eighth International Symposium on Wearable Computers - ISWC'04, 2004
4. M.J. Abreu, H. Carvalho, A. Catarino, A. Rocha, Integration and Embedding of Vital Signs Sensors and Other Devices into Textiles, Medical and Healthcare Textiles (Woodhead Publishing Textile Series Nr.75, Cambridge, 2010)
5. M. Catrysse, R. Puers, C. Hertleer, L. van Langenhove, H. van Egmond, D. Matthys, Towards the integration of textile sensors in a wireless monitoring suit. Sens. Actuators A 114, 302-311 (2004)
6. C. Lauterbach, R. Glaser, D. Savio, M. Schnell, W. Weber, Integrated microelectronics for smart textiles, in Studies in Health Technology and Informatics, vol. 117, ed. by C. Lauterach, S. Jung (Medicine Meets Virtual Reality, Newport Beach, 2005)
7. M. Silva, A. Catarino, H. Carvalho, A. Rocha, J. Monteiro, G. Montagna, Study of vital sign monitoring with textile sensor in swimming pool environment. in Proceedings of the IECON 2009, The 35th Annual Conference of The IEEE Industrial Electronics Society, Porto, 2009
8. Elektro-Feindraht, Textile Wire, http://www.textile-wire.ch/. Accessed 23 March 2011
9. R-Stat, R-Stat Antistatic and Antibacterial Fibre Producer. http://www.r-stat.com/GB/somproduitsgb.html. Accessed 23 March 2011
10. A.Schwarz, J.Hakuzimana, P. Westbroek, L. van Langenhove, How to Equip Para-aramide Yarns with Electro-Conductive Properties. Sixth International Workshop on Wearable and Implantable Body Sensor Networks, pp. 278-281 (2009)
11. R.V. Gregory, W.C. Kimbrell, H.H. Kuhn, Conductive Textiles, Synth. Met. 28, (1989)
12. ® electro-conductive fibre based - yarn based products for EMI-shielding textile applications. http://www.bekaert.com. Accessed 23 March 2011
13. J. Lind, S. Jayaraman, S. Park, R. Rajamanickam, R.Eisler, G. Burghart, and T. Mckee, A sensate liner for personnel monitoring applications, in Proceedings of the Second International Symposium on Wearable Computers, Pittsburgh, 1998)
14. R. Shishoo, Recent Developments in Fibers, yarns and fabrics for technical applications, in Proceedings of the 11th International Technical Textiles Symposium Technology Textiles, Nonwovens and Textile, Reinforced Materials, Frankfurt, Germany, 2001)
15. D. Marculescu, R. Marculescu, N.H. Zamora, P. Stanley-Marbell, P.K. Khosla, S. Park, S. Jayaraman, S. Jung, C. Lauterbach, W. Weber, T. Kirstein, D. Cottet, J. Grzyb, G. Troster, M. Jones, T. Martin, Z. Nahkad, Electronic textiles: A platform for pervasive computing. Proc IEEE 91, 12 (2003)
16. I. Locher, M. Klemm, T. Kirstein, G. Tröster, Design and characterization of purely textile patch antennas. IEEE Trans Adv Packag 29, 4 (2006)
17. S. Jung, C. Lauterbach, W. Weber, A digital music player tailored for smart textiles: First results, in Proceedings of Avantex Symposium, 2002
18. W. Weber, R. Glaser, S. Jung, C. Lauterbach, G. Stromberg, T. Sturm, Electronics in Textiles The Next Stage in Man Machine Interaction, Infineon Technologies AG, Corporate Research, Laboratory for Emerging Technologies
19. A.G. Infineon, eWLB Technology. http://annualreport2008.infineon.com/en/ template.asp?content = innovationen. Accessed 23 March 2011
20. Brewer Science, Thin Wafer Handling. http://www.brewerscience.com/ products/thin-wafer-handling/. Accessed 23 March 2011
21. R.Glaser, C. Lauterbach, D. Savio, M. Schnell et al., Smart Carpet: A Textile-based Large-area Sensor Network. http://www.future-shape.de/ publications-lauterbach/SmartFloor2005.pdf. Accessed 23 March 2011
22. M. Gonzalez, A. Fabrice, M.V. Bulcke, D. Brosteaux, B. Vendevelde, J. Vanfleteren, Design of metal interconnects for stretchable electronic circuits. Microelectron. Reliab. 48, 825-832 (2008)
23. L.M. Goncalves, J.G. Rocha, C. Couto, P. Alpuim, G. Min, D.M. Rowe, J.H. Correia, Fabrication of flexible thermoelectric microcoolers using planar thin-film technologies. J. Micromech. Microeng. 17, S168-S173 (2007)
24. Kapton HN technical Datasheet. http://www2.dupont.com/Kapton/en-US/ assets/downloads/pdf/HN-datasheet.pdf, [Online]. Accessed 23 March 2011
25. Kapton - Summary of properties. http://www2.dupont.com/Kapton/en-US/ assets/downloads/pdf/summaryofprop.pdf. Accessed 23 March 2011
26. T. Li, Z.Y. Huang, X.C. Zi, S.P. Lacour, S. Wagner, Z. Suo, Delocalizing strain in a thin metal film on a polymer substrate. Elsevier Mech. Mater. 37, 261-273 (2005)
27. Y. Xiang, X. Chen, J. Vlassak, The mechanical properties of electroplated Cu thin films measured by means of the bulge test techniques. Mater. Res. Soc. Symp. Proc 695, L4.9 (2002)
28. D.Y.W. Yu, F. Spaepen, The yield strength of thin copper films on Kapton. J. Appl. Phys. 95(6), 2991-2997 (2004)
29. Marc J. Madou, Fundamentals of Microfabrication, The Science of Miniaturization (CRC Press LLC, New York, 2002)
30. D. Meoli, T. May-Plumlee, Interactive electronic textile development: A review of technologies, J. Text. Appar. Technol. Manag. 2, 2(2002)