Characterization of thick film technology for 300°C packaging

International Conference and Exhibition on High Temperature Electronics 2010, HiTEC 2010

Volumn , Issue , 2010, Pages 97-107

  Zhang, Rui ^a   Wayne Johnson, R ^a   Tilak, Vinayak ^b   Zhang, Tan ^b   Shaddock, David ^b  

^a AUBURN UNIVERSITY   (United States)

^b GE GLOBAL RESEARCH   (United States)

Author keywords

High temperature; Packaging; Thick film

Indexed keywords

FUNCTIONAL CIRCUITS; HIGH TEMPERATURE; HIGH TEMPERATURE AGING; MULTILAYER DIELECTRICS; OPERATING TEMPERATURE; PACKAGING TECHNOLOGIES; SELECTION OF MATERIALS; THICK FILM TECHNOLOGY;

ELECTRIC PROPERTIES; GEOTHERMAL WELLS; PACKAGING; SILICON CARBIDE; THICK FILMS; WELL LOGGING;

TECHNOLOGY;

EID: 84878261017     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Jeffrey E. Naefe, R. Wayne Johnson, and Richard R., Grzybowski, "High-Temperature Storage and Thermal Shock Studies of Passive Component Attach Materials,", Proceedings of the 4th International High Temperature Electronics Conference, Albuquerque, NM, June 16-19, 1998, pp. 68-78.
2. J. S. Salmon, R. W. Johnson, and M. Palmer, "Thick Film Hybrid Packaging Techniques for 500°C Operation," Proceedings of 4th International High Temperature Electronics Conference, held in Albuquerque, NM, June 1998.
3. Jeong-Won Yoon, Hyun-Suk Chun, Ja-Myeong Koo and Seung-Boo Jung, "Au-Sn Flip-Chip Solder Bump For Microelectronic and Optoelectronic Applications," Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, Stresa, Italy, 26-28 April 2006.
4. R. Wayne Johnson, Cai Wang, Yi Liu, and James D. Scofield, "Power Device Packaging Technologies for Extreme Environments," IEEE Transactions on Electronics Packaging Manufacturing, Vol. 30, No. 3, July 2007, pp. 182-191.
5. M. Ishikawa, H. Sasaki, S. Ogawa, M. Kohinata, A. Mishima, and H. Yoshida, "Application of Gold-Tin Solder Paste for Fine Parts and Devices," Proc. 55th IEEE Electronic Components and Technology Conference, pp. 701-709 May/June 2005.