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1
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0035381906
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A 1.9-GHz DECT CMOS power amplifier with fully integrated multilayer LTCC passives
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June
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D. Heo, A. Sutono, E. Chen, Y. Suh, J. Laskar, "A 1.9-GHz DECT CMOS power amplifier with fully integrated multilayer LTCC passives", IEEE Microwave and Wireless Components Letters, Volume 11, Issue 6, June 2001 Page(s):249 - 251.
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(2001)
IEEE Microwave and Wireless Components Letters
, vol.11
, Issue.6
, pp. 249-251
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Heo, D.1
Sutono, A.2
Chen, E.3
Suh, Y.4
Laskar, J.5
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2
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0036706202
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A compact LTCC-based Ku-band transmitter module
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Aug.
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C. Lee; A. Sutono, S. Han; K. Lim; S. Pinel, E. M. Tentzeris, J. Laskar, "A compact LTCC-based Ku-band transmitter module", IEEE Trans. Adv. Packaging, Volume 25, Issue 3, Aug. 2002 Page(s):374 - 384.
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(2002)
IEEE Trans. Adv. Packaging
, vol.25
, Issue.3
, pp. 374-384
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Lee, C.1
Sutono, A.2
Han, S.3
Lim, K.4
Pinel, S.5
Tentzeris, E.M.6
Laskar, J.7
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3
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84876917934
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Improved integration density with fine line conductors on self-constrained sintered LTCC
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Annette Kipka, Quentin Reynolds, Andreas Henning, Stefan Malkmus, Frieder Gora, Christina Modes, "Improved Integration Density with Fine Line Conductors on Self-Constrained Sintered LTCC", in Proc. IMAPS, 2005, pp. 522-527.
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(2005)
Proc. IMAPS
, pp. 522-527
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Kipka, A.1
Reynolds, Q.2
Henning, A.3
Malkmus, S.4
Gora, F.5
Modes, C.6
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4
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84876890018
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Unidirectional cascade sintering in LTCC substrate
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Yong-Bin Sun, Ju-Hwan Ahn, Jeong-In Choi, Jae-Yun Kim, Eui-Jyong Choi, "Unidirectional Cascade Sintering in LTCC Substrate", in Proc. IMAPS, 2005, pp. 528-532.
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(2005)
Proc. IMAPS
, pp. 528-532
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Sun, Y.-B.1
Ahn, J.-H.2
Choi, J.-I.3
Kim, J.-Y.4
Choi, E.-J.5
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5
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84878261103
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Progress in the integration of planar and 3D Coils on LTCC by using photoimageable inks
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Ilmenau Technical University
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Rubén Perrone, Heiko Thust, Karl-Heinz Drüe, Ilmenau Technical University, "Progress in the Integration of Planar and 3D Coils on LTCC by using Photoimageable Inks", in Proc. IMAPS, 2004.
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(2004)
Proc. IMAPS
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Perrone, R.1
Thust, H.2
Drüe, K.-H.3
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6
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84878237643
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Lead free, zero shrink, substrate bonded LTCC system
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RL Wahlers, AH Feingold and M. Heinz, "Lead free, zero shrink, substrate bonded LTCC system", in Proc. IMAPS, 2005.
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(2005)
Proc. IMAPS
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Wahlers, R.L.1
Feingold, A.H.2
Heinz, M.3
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7
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84878233478
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Production development of a zero-shrink LTCC material system
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Frans Lautzenhiser, Weiming Zhang, Samson Shahbazi, "Production Development of a Zero-Shrink LTCC Material System", in Proc. IMAPS, 2005.
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(2005)
Proc. IMAPS
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Lautzenhiser, F.1
Zhang, W.2
Shahbazi, S.3
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8
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0043159552
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HeraLockTM 2000 self-constrained LTCC tape - Benefits and applications
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P. Barnwell, E. Amaya, F. Lautzenhiser, J. Wood, "HeraLockTM 2000 Self-constrained LTCC Tape - Benefits and Applications", in Proc. IMAPS Nordic, 2002.
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(2002)
Proc. IMAPS Nordic
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Barnwell, P.1
Amaya, E.2
Lautzenhiser, F.3
Wood, J.4
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9
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84878238920
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http://www.thetravelinsider.info/roadwarriorcontent/quadbandphones.htm.
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11
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84878221462
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Using LFC technology, murata makes automotive ceramic substrates
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serial number 103, April
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Katsuhiko Naka, "Using LFC Technology, Murata Makes Automotive Ceramic Substrates", Asia Electronics Industry, vol. 10, serial number 103, April 2005, pp. 50-52.
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(2005)
Asia Electronics Industry
, vol.10
, pp. 50-52
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Naka, K.1
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12
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84878234632
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LTCC technology, an integration solution for power electronics
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M. H. F. Lim, J. D. van Wyk and Z. Liang, "LTCC Technology, an Integration Solution for Power Electronics", Ceramics Interconnect and Ceramics Microsystems Conf., 25-27April 2006.
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Ceramics Interconnect and Ceramics Microsystems Conf., 25-27April 2006
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Lim, M.H.F.1
Van Wyk, J.D.2
Liang, Z.3
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13
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33749531769
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Low profile integratable inductor fabricated based on LTCC technology for microprocessor power delivery applications
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19-23 March
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M. H. F. Lim, Z. Liang, and J. D. van Wyk, "Low Profile Integratable Inductor Fabricated Based On LTCC Technology For Microprocessor Power Delivery Applications", Appl. Power Electronics Conf., 19-23 March 2006.
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(2006)
Appl. Power Electronics Conf.
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Lim, M.H.F.1
Liang, Z.2
Van Wyk, J.D.3
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14
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84878257945
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Improvements in light load converter efficiency by variable inductance integratable inductor fabricated using LTCC technology
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23-25 April
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M. H. F. Lim, Z. Liang, and J. D. van Wyk, "Improvements in light load converter efficiency by variable inductance integratable inductor fabricated using LTCC technology", Center for Pow. Electronics Conf., 23-25 April 2006.
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(2006)
Center for Pow. Electronics Conf.
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Lim, M.H.F.1
Liang, Z.2
Van Wyk, J.D.3
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15
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84878244533
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Area enclosed in a B-H loop represents the hysteresis loss per unit volume of the magnetic material
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Mc Graw-Hill, ISBN: 0-256-16173-9
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S. O Kasap, "Principles of Electrical Engineering Materials and Devices", Mc Graw-Hill, ISBN: 0-256-16173-9., pp. 664: Area enclosed in a B-H loop represents the hysteresis loss per unit volume of the magnetic material.
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Principles of Electrical Engineering Materials and Devices
, pp. 664
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Kasap, S.O.1
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