LTCC technology, an integration solution for power electronics

IMAPS/ACerS - 2nd International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2006

Volumn , Issue , 2006, Pages 376-381

  Lim, M H F ^a   Van Wyk, J D ^a   Liang, Z ^a  

^a State University   (United States)

Author keywords

LTCC; Passive components; Power electronics; Rectangular conductor cross sectional shape

Indexed keywords

CONVERTER EFFICIENCY; CROSS SECTIONAL AREA; CROSS-SECTIONAL SHAPE; CURRENT HANDLING CAPABILITY; FABRICATION PROCESS; LTCC; PASSIVE COMPONENTS; POWER-HANDLING CAPABILITY;

CERAMIC MATERIALS; DC-DC CONVERTERS; ELECTRIC POWER TRANSMISSION; EXHIBITIONS; HETEROJUNCTION BIPOLAR TRANSISTORS; MICROSYSTEMS; POWER INDUCTORS; SURFACE MOUNT TECHNOLOGY; TECHNOLOGY;

POWER ELECTRONICS;

EID: 84878234632     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (20)

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