Performance and reliability of MEMS gyroscopes and packaging at high temperatures

International Conference and Exhibition on High Temperature Electronics 2010, HiTEC 2010

Volumn , Issue , 2010, Pages 359-366

  McCluskey, Patrick ^a   Patel, Chandradip ^a   Lemus, David ^b  

^a UNIVERSITY OF MARYLAND   (United States)

^b TRX Systems Inc   (United States)

Author keywords

MEMS; Packaging; Reliability; Sensors; Tracking

Indexed keywords

EFFECT OF TEMPERATURE; ELEVATED TEMPERATURE; INDOOR ENVIRONMENT; MEMS GYROSCOPE SENSORS; PERFORMANCE AND RELIABILITIES; RESONANT GYROSCOPES; THERMO-MECHANICAL STRESS; TRACKING APPLICATION;

GYROSCOPES; HIGH TEMPERATURE APPLICATIONS; MEMS; PACKAGING; RELIABILITY; SURFACE DISCHARGES; TEMPERATURE; THERMAL EXPANSION;

SENSORS;

EID: 84878249204     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Jin-Won Joo and Sung-Hoon Choa, "Deformation Behavior of MEMS Gyroscope Sensor Package Subjected to Temperature Changes," IEEE Transactions on Components and Packaging Technologies, Vol.30, NO.2, June 2007
2. Steven Nasiri, "A Critical Review of MEMS Gyroscopes Technology and Commercialization Status," Inven Sense.
3. Z. Szucs, G. Nagy, S. Hodossy, M. Rencz, A. Poppe, "Vibration Combined High Temperature Cycle Tests for Capacitive MEMS Accelerometers,", Therminic 2006, September 2006
4. Shcheglov, K., et al, Temperature dependent characteristics of the JPL silicon MEMS gyroscope, Proceedings 2000 IEEE Aerospace Conference, Big Sky, MT, USA, March 18-25, 2000, pp. 403-411.
5. Donnelly M. K., Davis W. D., Lawson, J. R., and Selepak, M. S., "Thermal Environment for Electronic Equipment used by First Responders," National Institute of Standards and Technology, Gaithersburg, MD, NIST Technical Note 1474; January 2006