LTCC packaging for bio-application's demands

IMAPS/ACerS - 2nd International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2006

Volumn , Issue , 2006, Pages 233-238

  Rebenklau, L ^a   Schlottig, G ^a   Uhlemann, J ^a   Vollmer, G ^a   Wolter, K J ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Bio packaging; Biocompatibility; LTCC

Indexed keywords

ASSEMBLING PROCESS; BIOLOGICAL CHARACTERISTIC; BIOLOGICAL EVALUATION; LTCC; MICRO FLUIDIC APPLICATIONS; MICRO-HEAT EXCHANGERS; NON-ELECTRIC FIELD; THICK FILM TECHNOLOGY;

ADHESIVES; BIOCOMPATIBILITY; BIOLOGICAL MATERIALS; BIOMEDICAL EQUIPMENT; ELECTRIC FIELDS; EXHIBITIONS; MICROFLUIDICS; MICROSYSTEMS; PACKAGING; THICK FILMS;

CERAMIC MATERIALS;

EID: 84878224727     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

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