Properties and characteristics of wet (HF) and dry (RIE) etched borosilicate glass

Physica Status Solidi (A) Applications and Materials Science

Volumn 210, Issue 5, 2013, Pages 988-993

  Blass, J ^a   Kohler O ^a   Fingerle, M ^a   Muller C ^a   Ziegler, C ^a  

^a Rheinland Pfälzische Technische Universität Kaiserslautern Landau   (Germany)

Author keywords

glass packaging material; roughness; wet and dry etching

Indexed keywords

CHEMICAL ALTERATION; ETCHING PARAMETERS; ETCHING PROCESS; GLASS PACKAGING; GLASS SURFACES; ISO-ELECTRIC POINTS; PROTEIN ADSORPTION; WET AND DRY ETCHINGS;

BOROSILICATE GLASS; CHEMICAL ANALYSIS; CONTACT ANGLE; DRY ETCHING; GLASS PLANTS; PACKAGING MATERIALS;

SURFACE ROUGHNESS;

EID: 84878011165     PISSN: 18626300     EISSN: 18626319     Source Type: Journal    
DOI: 10.1002/pssa.201200769     Document Type: Article

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