Microwave foaming of starch-based materials (I) dielectric performance

Journal of Cellular Plastics

Volumn 49, Issue 3, 2013, Pages 245-258

  Peng, Xi ^a   Song, Jim ^b   Nesbitt, Alan ^c   Day, Richard ^c  

^a Smithers Viscient   (United States)

^b BRUNEL UNIVERSITY   (United Kingdom)

^c UNIVERSITY OF MANCHESTER   (United Kingdom)

Author keywords

extrusion; foam; microwave heating; packaging; Starch; wheat flour

Indexed keywords

DIELECTRIC LOSS FACTORS; DIELECTRIC PERFORMANCE; EXTRUDED STARCHES; FOAMABILITY; FOAMING MECHANISM; ORGANIC ADDITIVES; STARCH-BASED MATERIALS; WHEAT FLOURS;

DIELECTRIC PROPERTIES; EXTRUSION; FOAMS; GLASS TRANSITION; MICROWAVE HEATING; MICROWAVES; PACKAGING; PELLETIZING; STARCH;

DIELECTRIC MATERIALS;

EID: 84877733760     PISSN: 0021955X     EISSN: 15307999     Source Type: Journal    
DOI: 10.1177/0021955X13477438     Document Type: Article

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