Effect of Cu powder addition on thermoelectric properties of Cu/TiO 2-x composites

Ceramics International

Volumn 39, Issue 6, 2013, Pages 6689-6694

  Lu, Yun ^a   Sagara, Katsuhiro ^a   Matsuda, Yusuke ^a   Hao, Liang ^a   Rong Jin, Ying ^b   Yoshida, Hiroyuki ^c  

^a CHIBA UNIVERSITY   (Japan)

^b XIHUA UNIVERSITY   (China)

^c Chiba Industrial Technology Research Institute   (Japan)

Author keywords

A. Sintering; B. Composites; D. TiO2; E. Functional applications

Indexed keywords

COMPOSITE FORMATION; E. FUNCTIONAL APPLICATIONS; ELECTRICAL RESISTIVITY; GENERAL EFFECTIVE MEDIUM THEORY; SEMICONDUCTOR BEHAVIOR; THERMOELECTRIC PERFORMANCE; THERMOELECTRIC PROPERTIES; TIO;

ELECTRIC CONDUCTIVITY; SPARK PLASMA SINTERING; THERMOELECTRIC EQUIPMENT; TITANIUM DIOXIDE;

THERMOELECTRICITY;

EID: 84877716256     PISSN: 02728842     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ceramint.2013.01.107     Document Type: Article

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