Flex technology for foldable medical flip chip devices

IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Global Business Council, GBC 2008 Spring Conference

Volumn , Issue , 2008, Pages 7-12

  Pahl, Barbara ^a   Loeher, Thomas ^a   Burkard, Hans ^b   Link, Josef ^b   Petersen, A ^c   Aschenbrenner, R ^d  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^b HIGHTEC MC AG   (Switzerland)

^c OTICON A S   (Denmark)

^d FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION FIELDS; DISTRIBUTED SENSOR; GALVANIC DEPOSITION; MECHANICAL AND ELECTRICAL PROPERTIES; MULTILAYER CIRCUITS; SCANNING ACOUSTIC MICROSCOPY; THIN-FILM TECHNIQUE; WEARABLE ELECTRONICS;

BIOMEDICAL EQUIPMENT; CHIP SCALE PACKAGES; ELECTRIC PROPERTIES; EXHIBITIONS; FILM PREPARATION; FLIP CHIP DEVICES; HEARING AIDS; MULTILAYERS; POLYIMIDES; SENSOR NODES; THREE DIMENSIONAL COMPUTER GRAPHICS;

SUBSTRATES;

EID: 84877310543     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. A. Fach et al., Multilayer polyimide film substrate for interconnections in microsystems, Microsystem Technologies, Volume 5, pp. 166-168, 1999
2. Hans Burkard, Thin Film Resistor Integration into Flex-Boards, 5th International Workshop 'Flexible Electronic Systems', November 29, 2006, Munich
3. J. Haberland, B. Pahl et al., Super Thin Flip Chip Assemblies on Flex Substrates Adhesive Bonding and Soldering Technology-Reliability Investigations and Applications; proc. of IMAPS2006 San Jose