Multilayer polyimide film substrates for interconnections in microsystems

Microsystem Technologies

Volumn 5, Issue 4, 1999, Pages 166-168

  Fach, A ^a   Athanassov, Y ^a   Brunner, U ^a   Hablutzel D ^a   Ketterer, B ^a   Link, J ^a  

^a HIGHTEC MC AG   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0006716227     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s005420050158     Document Type: Article

References (1)

1. Fach A; Ketter B; Brunner U; Link J (1998) Multilayer film substrates with 30 μm vias for MCM applications, Proc. Int. Conf. on Multichip Modules, Denver, Colorado, 15-17 April