Micro-fluidic Optoelectronic Packages based on LTCC

Proceedings - 2007 International Symposium on Microelectronics, IMAPS 2007

Volumn , Issue , 2007, Pages 429-436

  Stephens, Edward F ^a   Feeler, Ryan ^a   Kemner, Greg ^a   Barlow, Fred ^b   Wood, Jared ^b   Elshabini, Aicha ^b  

^a Northrop Grumman Cutting Edge Optronics   (United States)

^b UNIVERSITY OF IDAHO   (United States)

Author keywords

Laser diodes; LTCC; Micro fluidic package; Optoelectronic packaging

Indexed keywords

COPPER MULTILAYERS; ELECTRICAL ISOLATION; FABRICATION PROCESS; LTCC; OPERATING TEMPERATURE; OPTOELECTRONIC PACKAGES; OPTOELECTRONIC PACKAGING; PACKAGING TECHNOLOGIES;

COOLANTS; COOLING SYSTEMS; DIODES; EROSION; IONIZATION; MICROELECTRONICS; PUMPING (LASER); SEMICONDUCTOR LASERS; WASTE HEAT; YLF LASERS;

PACKAGING;

EID: 84876949901     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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