Reliability analysis of bonded joints with variations in adhesive thickness

Journal of Adhesion Science and Technology

Volumn 27, Issue 10, 2013, Pages 1069-1079

  Mathias, Jean Denis ^a   Lemaire, Maurice ^b  

^a Cemagref   (France)

^b UNIVERSITÉ CLERMONT AUVERGNE   (France)

Author keywords

adhesive thickness; bonded joint; failure; reliability; shear stress; stochastic field

Indexed keywords

ADHESIVE THICKNESS; BONDED JOINT; FAILURE PROBABILITY; SPATIAL VARIABILITY; SPATIAL VARIATIONS; STOCHASTIC FIELD; STOCHASTIC PARAMETERS; STRUCTURAL RELIABILITY;

COMPUTER SYSTEM RECOVERY; INDUSTRIAL APPLICATIONS; RELIABILITY; RELIABILITY ANALYSIS; SHEAR STRESS; STOCHASTIC SYSTEMS; STRESS CONCENTRATION;

ADHESIVE JOINTS;

EID: 84876750594     PISSN: 01694243     EISSN: 15685616     Source Type: Journal    
DOI: 10.1080/01694243.2012.727176     Document Type: Article

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