A modified creep model of epoxy adhesive at ambient temperature

International Journal of Adhesion and Adhesives

Volumn 29, Issue 4, 2009, Pages 396-404

  Majda, Paweł ^a   Skrodzewicz, Janusz ^a  

^a WEST POMERANIAN UNIVERSITY OF TECHNOLOGY   (Poland)

Author keywords

Creep; Epoxides; Mechanical properties of adhesive

Indexed keywords

ADHESION; CREEP; EXPERIMENTS; MECHANICAL PROPERTIES; STRESSES; TENSILE STRENGTH; TENSILE STRESS;

AMBIENT TEMPERATURES; BOLTZMANN'S SUPERPOSITION PRINCIPLES; BURGERS MODELS; CONSTANT MODULUS; CREEP BEHAVIORS; CREEP CHARACTERISTICS; CREEP DEFORMATIONS; CREEP MODELS; DURATION TIMES; ELASTIC STRAINS; EPOXIDES; EPOXY ADHESIVES; EXPERIMENTAL INVESTIGATIONS; MATHEMATICAL TREATMENTS; MECHANICAL PROPERTIES OF ADHESIVE; PARAMETER VALUES; RHEOLOGICAL EFFECTS; ROOM TEMPERATURES; SHORT TIMES; VISCOELASTIC MEDIUMS; VISCOELASTIC PROPERTIES;

EPOXY RESINS;

EID: 58349085294     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijadhadh.2008.07.010     Document Type: Article

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