3D volumetric ultrasound imaging with a 32×32 CMUT array integrated with front-end ICs using flip-chip bonding technology

Digest of Technical Papers - IEEE International Solid-State Circuits Conference

Volumn 56, Issue , 2013, Pages 396-397

  Bhuyan, Anshuman ^a   Choe, Jung Woo ^a   Lee, Byung Chul ^a   Wygant, Ira ^b   Nikoozadeh, Amin ^a   Oralkan, Omer ^c   Khuri Yakub, Butrus T ^a  

^a STANFORD UNIVERSITY   (United States)

^b TEXAS INSTRUMENTS   (United States)

^c NORTH CAROLINA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3D IMAGING SYSTEM; 3D ULTRASOUND IMAGES; 3D ULTRASOUND IMAGING; CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER; FLIP-CHIP BONDING; MECHANICAL DEMONSTRATIONS; TRANSDUCER ARRAY; ULTRASOUND IMAGING;

DIAGNOSIS; FLIP CHIP DEVICES; IMAGING SYSTEMS; TISSUE; TRANSDUCERS; ULTRASONIC IMAGING; ULTRASONIC TRANSDUCERS; ULTRASONICS;

THREE DIMENSIONAL COMPUTER GRAPHICS;

EID: 84876523487     PISSN: 01936530     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSCC.2013.6487786     Document Type: Conference Paper

References (5)

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2. A.S. Ergun, Y. Huang, X. Zhuang oralkan, G.G. Yaralioglu, and B.T. Khuri-Yakub, "Capacitive Micromachined Ultrasonic Transducers: Fabrication Technology," IEEE Trans. Ultrason., Ferroelect., Freq. Contr., vol. 52, no. 12, pp. 2242-2258, Dec. 2005
3. I.O. Wygant, N.S. Jamal, H.J. Lee, et al., "An Integrated Circuit with Transmit Beamforming Flip-Chip Bonded to a 2-D CMUT Array for 3-D Ultrasound Imaging," IEEE Trans. Ultrason., Ferroelect., Freq. Contr., vol. 56, no. 10, pp. 2145-56, Oct. 2009
4. M. Declerq, M. Schubert, and F. Clement, "5 V-To-75 V CMOS Output Interface Circuits," ISSCC Dig. Tech. Papers, pp. 162-163, 283, Feb. 1993
5. M. Karaman, I.O. Wygant Oralkan, and B.T. Khuri-Yakub, "Minimally Redundant 2-D Array Designs for 3-D Medical Ultrasound Imaging," IEEE Trans. Med. Imag., vol. 28, no. 7, pp. 1051-1061, July 2009