An integrated circuit with transmit beamforming flip-chip bonded to a 2-D CMUT array for 3-D ultrasound imaging

IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control

Volumn 56, Issue 10, 2009, Pages 2145-2156

  Wygant, Ira O ^a   Jamal, Nafis S ^a   Lee, Hyunjoo J ^a   Nikoozadeh, Amin ^a   Oralkan, Ömer ^a   Karaman, Mustafa ^b   Khuri Yakub, Butrus T ^a  

^a STANFORD UNIVERSITY   (United States)

^b ISIK UNIVERSITY   (Turkey)

Author keywords

[No Author keywords available]

Indexed keywords

2D-ARRAYS; 3-D IMAGE; 3-D ULTRASOUND; BEAM FORMERS; CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER; CENTER FREQUENCY; CROSS SECTIONAL IMAGE; FLIP CHIP; FOCUSED ULTRASOUND; INTEGRATED CIRCUITRY; LOW NOISE; MEDICAL ULTRASOUND IMAGING; PULSE WIDTH; TRANSDUCER ARRAY; TRANSDUCER ELEMENTS; TRANSIMPEDANCE AMPLIFIERS; TRANSMIT BEAMFORMING; ULTRASOUND SIGNAL; ULTRASOUND TRANSDUCERS; UNIPOLAR PULSE;

BEAMFORMING; DIFFERENTIAL AMPLIFIERS; ELECTROACOUSTIC TRANSDUCERS; FIELD PROGRAMMABLE GATE ARRAYS (FPGA); FLIP CHIP DEVICES; INTEGRATED CIRCUITS; MEDICAL IMAGING; OPTOELECTRONIC DEVICES; PIEZOELECTRIC TRANSDUCERS; THREE DIMENSIONAL; ULTRASONIC PROPAGATION; ULTRASONIC SCATTERING; ULTRASONIC TRANSDUCERS; ULTRASONIC TRANSMISSION; ULTRASONIC WAVES; ULTRASONICS;

ULTRASONIC IMAGING;

ARTICLE; ECHOCARDIOGRAPHY; ECHOGRAPHY; ELECTRONICS; EQUIPMENT DESIGN; IMAGE QUALITY; INSTRUMENTATION; METHODOLOGY; THREE DIMENSIONAL IMAGING; TRANSDUCER;

ECHOCARDIOGRAPHY; ELECTRONICS, MEDICAL; EQUIPMENT DESIGN; IMAGING, THREE-DIMENSIONAL; PHANTOMS, IMAGING; TRANSDUCERS; ULTRASONOGRAPHY;

EID: 72749107528     PISSN: 08853010     EISSN: None     Source Type: Journal    
DOI: 10.1109/TUFFC.2009.1297     Document Type: Article

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