Study on the influence of various factors in the hydrometallurgical processing of waste printed circuit boards for copper and gold recovery

Waste Management

Volumn 33, Issue 4, 2013, Pages 935-941

  Birloaga, Ionela ^a   De Michelis, Ida ^b   Ferella, Francesco ^b   Buzatu, Mihai ^a   Vegliò, Francesco ^b  

^a UNIVERSITY POLITEHNICA OF BUCHAREST   (Romania)

^b UNIVERSITY OF L'AQUILA   (Italy)

Author keywords

Copper; Gold; Oxidative leaching; Printed circuit boards; Thiourea

Indexed keywords

ACID CONCENTRATIONS; COPPER DISSOLUTION; COPPER EXTRACTION; EXPERIMENTAL STUDIES; HYDROMETALLURGICAL PROCESSING; METAL EXTRACTIONS; OXIDATIVE LEACHING; WASTE PRINTED CIRCUIT BOARD;

COPPER; GOLD; LEACHING; PARTICLE SIZE; PRINTED CIRCUIT BOARDS; PROGRAM PROCESSORS; SULFUR DETERMINATION; SULFURIC ACID; THIOUREAS;

EXTRACTION;

COPPER; GOLD; HYDROGEN PEROXIDE; SULFURIC ACID; THIOUREA;

CONCENTRATION (COMPOSITION); COPPER; EXPERIMENTAL STUDY; EXTRACTION METHOD; GOLD; HYDROGEN PEROXIDE; LEACHING; METALLURGY; PARTICLE SIZE; REMOVAL EXPERIMENT; SULFURIC ACID; TEMPERATURE; VARIANCE ANALYSIS;

ARTICLE; CONCENTRATION (PARAMETERS); DISSOLUTION; EXPERIMENTAL STUDY; HEAVY METAL REMOVAL; HYDROMETALLURGICAL PROCESSING; LEACHING; METAL EXTRACTION; PARTICLE SIZE; PRIORITY JOURNAL; PROCESS OPTIMIZATION; PRODUCT RECOVERY; TEMPERATURE SENSITIVITY; WASTE MANAGEMENT;

ANALYSIS OF VARIANCE; COPPER; ELECTRONIC WASTE; GOLD; HYDROGEN PEROXIDE; RECYCLING; SULFURIC ACIDS; TEMPERATURE; THIOUREA;

EID: 84875811377     PISSN: 0956053X     EISSN: 18792456     Source Type: Journal    
DOI: 10.1016/j.wasman.2013.01.003     Document Type: Article

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