Improved mechanical and thermomechanical properties of alumina substrate via iron doping

Scripta Materialia

Volumn 68, Issue 11, 2013, Pages 869-872

  I Made, Riko ^a   Phua, Eric Jian Rong ^a,b   Pramana, Stevin Snellius ^a,c   Wong, Chee Cheong ^a   Chen, Zhong ^a   Tok, Alfred Iing Yoong ^a   Gan, Chee Lip ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

^c NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Ceramics; Electronics packaging; Harsh environment; High pressure; High temperature

Indexed keywords

CERAMICS; ELECTRON PROBE MICROANALYSES; GRAIN BOUNDARY STRENGTHENING; HARSH ENVIRONMENT; HIGH PRESSURE; HIGH TEMPERATURE; MECHANICAL AND THERMO-MECHANICAL PROPERTIES; THERMAL EXPANSION COEFFICIENTS;

ELECTRONICS PACKAGING; GRAIN BOUNDARIES; SINTERING; THERMAL CONDUCTIVITY;

SINTERED ALUMINA;

EID: 84875496075     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2013.02.032     Document Type: Article

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