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Volumn 531, Issue , 2013, Pages 349-353
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Improvement of mechanical reliability by patterned silver/Indium-Tin-Oxide structure for flexible electronic devices
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Author keywords
Cracking; Flexible optoelectronic devices; Indium Tin Oxide; Silver; Stress corrosion; Young's modulus
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Indexed keywords
DYNAMIC BENDING TEST;
FLEXIBLE ELECTRONIC DEVICES;
INDIUM TIN OXIDE;
MECHANICAL CHARACTERISTICS;
MECHANICAL RELIABILITY;
OPTICAL CHARACTERISTICS;
STRESS CORROSION;
YOUNG'S MODULUS;
BENDING TESTS;
CRACK INITIATION;
ELASTIC MODULI;
ELECTRIC PROPERTIES;
FLEXIBLE DISPLAYS;
INDIUM;
OPTOELECTRONIC DEVICES;
POLYETHYLENE TEREPHTHALATES;
SHEET RESISTANCE;
STRESS CORROSION CRACKING;
TIN;
SILVER;
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EID: 84875423161
PISSN: 00406090
EISSN: None
Source Type: Journal
DOI: 10.1016/j.tsf.2012.12.075 Document Type: Article |
Times cited : (15)
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References (16)
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