Surface acoustic wave component packaging

16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007

Volumn , Issue , 2007, Pages 125-129

  Feiertag, G ^a   Kruger, H ^a   Bauer, C ^a  

^a EPCOS AG   (Germany)

Author keywords

BAW; Cavity package; FBAR; MEMS package; SAW filter; Surface acoustic wave

Indexed keywords

BAW; CAVITY PACKAGE; FBAR; MEMS PACKAGES; SA WFILTER; SURFACE ACOUSTIC WAVES;

ACOUSTIC SURFACE WAVE DEVICES; ACOUSTIC WAVES; CHIP SCALE PACKAGES; EXHIBITIONS; FLIP CHIP DEVICES; MICROELECTRONICS; PACKAGING; POLYCHLORINATED BIPHENYLS; SURFACE WAVES;

ACOUSTIC SURFACE WAVE FILTERS;

EID: 84875298904     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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