Chip scale package for SAW filter on the oxidized porous silicon using flip-chip bonding and Cu plated metal wall

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 372-377

  Ha, Man Lyun ^a   Lee, Jong Soo ^a   Kwon, Young Se ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC SURFACE WAVE FILTERS; COPPER; ELECTRIC LINES; FLIP CHIP DEVICES; POROUS SILICON; SPURIOUS SIGNAL NOISE; SUBSTRATES;

FLIP-CHIP BONDING;

CHIP SCALE PACKAGES;

EID: 0036297015     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

1. An application of a flip-chip-bonding technique to GHz-Band SAW filters for mobile communication
2. Miniaturized SAW filters using a flip-chip technique
3. Miniaturization and advanced functionalities of SAW devices
4. Coplanar waveguides on silicon substrate with thick oxidized porous silicon (OPS) layer
5. GaAs multichip packaging using the selectively oxidized porous silicon (SOPS) substrate
6. MCM technology for RF tunable band pass filters implemented by integration of GaAs FETs and selectively oxidized porous silicon (SOPS)
7. High-performance planar inductor on thick oxidized porous silicon (OPS) substrate
8. A 1.5 GHz-band SAW filter using flip-chip-bonding technique
9. Multichip module on silicon for SAW filter embeded RF receiver
10. An 800 MHz-band front-end MCM for antenna diversity type mobile communication handset terminals
11. Dual-band/Tri-mode receiver IC for N- and W-CDMA systems using 6″-HEMT technology