Development of chip to antenna interconnections for contact-less smart card applications

16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007

Volumn , Issue , 2007, Pages 467-472

  Lenkkeri, Jaakko ^a   Kivelä, Sari ^a   Juntunen, Eveliina ^a   Jaakola, Tuomo ^a   Nummila, Kaj ^a   Allen, Mark ^a   Kaskiala, Toni ^b   Hillmann, Gerhard ^b   Mathewson, Alan ^c  

^a VTT TECHNICAL RESEARCH CENTRE OF FINLAND   (Finland)

^b Setec/Gemalto ^*  (Austria)

^c CEA LETI   (France)

Author keywords

ACA; Antenna; Flip chip; NCA; RFID; Smart card

Indexed keywords

ACA; ANISOTROPICALLY CONDUCTIVE ADHESIVE; FLIP CHIP; INTERCONNECTION METHOD; NCA; NON-CONDUCTIVE ADHESIVES; SMART-CARD APPLICATION; THINNED SILICON CHIPS;

ADHESIVE JOINTS; ANTENNAS; EXHIBITIONS; MICROELECTRONICS; RADIO FREQUENCY IDENTIFICATION (RFID); SMART CARDS; SOLDERING; SUBSTRATES; SURFACE ROUGHNESS;

CHIP SCALE PACKAGES;

EID: 84875296680     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. M. L. Allen, K. Jaakkola, K. Nummila, H. Seppä,Applicability of metallic nanoparticle inks in RFID applications, manuscript to be published.
2. th European Microelectronics and Packaging Conference, Germany, 23-25. June 2003.
3. A. Ostman, J. De Baets, A. Kriechbaum, H. Kostner, A. Neumann, Technology for Embedding Active Dies. EMPC2005, June 12-15, Brugge, Belgium.
4. N.Sillon J-C Souriau, J.Brun. Proc. "Innovative flip chip Solution For System On Wafer Concept" - First International Workshop on 3S (SOP, SIP, SOC) Electronic Technologies, Atlanta, September 23 2005.